HFA11XXEVAL Intersil, HFA11XXEVAL Datasheet - Page 11

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HFA11XXEVAL

Manufacturer Part Number
HFA11XXEVAL
Description
EVALUATION PLATFORM HFA11XX
Manufacturer
Intersil
Datasheet

Specifications of HFA11XXEVAL

Channels Per Ic
1 - Single
Amplifier Type
General Purpose
Board Type
Partially Populated
Utilized Ic / Part
8-DIP Package
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Operating Temperature
-
Output Type
-
Current - Output / Channel
-
Voltage - Supply, Single/dual (±)
-
-3db Bandwidth
-
Slew Rate
-
Current - Supply (main Ic)
-
Die Characteristics
DIE DIMENSIONS:
METALLIZATION:
Metallization Mask Layout
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
53 mils x 25mils
1350μm x 630μm
Type: Metal 1: AlCu (2%)/TiW
Thickness: Metal 1: 8k
Type: Metal 2: AlCu (2%)
Thickness: Metal 2: 16k
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
For information regarding Intersil Corporation and its products, see web site www.intersil.com
Å
Å
±0.4k
11
±0.8k
Å
Å
V+
-IN
HFA1150
HFA1150
PASSIVATION:
TRANSISTOR COUNT:
SUBSTRATE POTENTIAL (POWERED UP):
Type: Nitride
Thickness: 4k
40
Floating (Recommend Connection to V-)
OUT
+IN
V-
Å
±0.5k
Å

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