LMH730121 National Semiconductor, LMH730121 Datasheet
LMH730121
Specifications of LMH730121
Related parts for LMH730121
LMH730121 Summary of contents
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... A convenient way to connect C9 (positive side) to the inputs is by performing the following: 1. Cut R7 and R10 connection to ground plane, on circuit side. 2. Install 0 resistances for R7 and R10 3. Tie C9 (positive side) to the cut side of R7 and R10. 2001 National Semiconductor Corporation 8-pin Thermally Enhanced SOIC (PSOP) . Figure 1: Complete Evaluation Board Schematic ...
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... DAP connection from ground and tie each device for information on DAP connection and whether this modification is required for the particular device. MODIFICATIONS TO ISOLATE HEATSINK FROM GND AND TIE 2001 National Semiconductor Corporation - (see below for modifications needed to the board) - instead (see instructions below) ...
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... National Semiconductor Corporation Bottom Side 3 www.national.com Top Side ...
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... NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTENT APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant ...