CLC730045 National Semiconductor, CLC730045 Datasheet

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CLC730045

Manufacturer Part Number
CLC730045
Description
BOARD EVAL FOR SGL BUFFER SOIC
Manufacturer
National Semiconductor
Datasheet

Specifications of CLC730045

Channels Per Ic
1 - Single
Amplifier Type
Buffer
Board Type
Bare (Unpopulated)
Utilized Ic / Part
8-SOIC Package
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Operating Temperature
-
Output Type
-
Current - Output / Channel
-
Voltage - Supply, Single/dual (±)
-
-3db Bandwidth
-
Slew Rate
-
Current - Supply (main Ic)
-
N
The CLC730012 is an evaluation board intended for the
evaluation of single buffers in the DIP package. The
CLC730045 is a similar board, but laid out for an SOIC
package.
To obtain optimum performance from a high speed
device, a good Printed Circuit Board (PCB) layout is
essential. The importance of the layout becomes greater
as the frequency of operation increases.
Comlinear’s buffers have bandwidths in excess of 800
MHZ, therefore it is vital that sound PCB layout tech-
niques be used when designing with these devices. The
CLC730012 and CLC730045 are examples of good PCB
layouts which designers are encouraged to copy.
To minimize capacitive feedthrough and noise, the pins
not connected internally, should be connected to the
ground plane. Input and output traces should be laid out
as transmission lines with the appropriate termination
resistors very near the device. On a 0.0065” (FR4 or
equivalent) a 0.1” wide trace over ground plane on the
opposite side of the board will exhibit a characteristic
impedance of 50 .
Figure 1 shows recommended power supply bypassing.
The ferrite beads are optional and are recommended only
where additional isolation is needed from high-frequency
(>400MHz) resonances of the power supply.
Parasitic or load capacitance directly on the output of a
buffer will introduce additional phase shift in the device. If
excessive, this phase shift can lead to peaking in the fre-
quency response or, in extreme cases, oscillation. A
small series resistor in series with a capacitive load effec-
tively decouples it from the buffer output and removes the
undesirable effects of excess phase shift. Further detail
on the selection of these resistors can be found in the indi-
vidual buffer data sheets.
Parts List
R
R
C
C
L
© 1996 National Semiconductor Corporation
Printed in the U.S.A.
1
IN
OUT
1
3
, L
, C
, C
2
2
4
select for desired input resistance
select for desired output resistance
0.1 F capacitor
6.8 F capacitor
Optional ferrite bead inductors
Some of
CLC109/110/111 Evaluation Boards
Part Numbers CLC730012, CLC730045
Figure 2: Component Placement Guide
Figure 1: Recommended Circuit and
Evaluation Board Schematic
http://www.national.com
August 1996

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CLC730045 Summary of contents

Page 1

... N The CLC730012 is an evaluation board intended for the evaluation of single buffers in the DIP package. The CLC730045 is a similar board, but laid out for an SOIC package. To obtain optimum performance from a high speed device, a good Printed Circuit Board (PCB) layout is essential. The importance of the layout becomes greater as the frequency of operation increases. Comlinear’ ...

Page 2

... Figure 5: 730045 Solder Side (bottom) viewed from Component Side (top) Customer Design Applications Support National Semiconductor is committed to design excellence. For sales, literature and technical support, call the National Semiconductor Customer Response Group at 1-800-272-9959 or fax 1-800-737-7018. Life Support Policy National’s products are not authorized for use as critical components in life support devices or systems without the express written approval of the president of National Semiconductor Corporation ...

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