ADP2106-1.8-EVALZ Analog Devices Inc, ADP2106-1.8-EVALZ Datasheet - Page 33

• Manufacturer Part Number: ADP2106-1.8-EVALZ
• Description: BOARD EVAL FOR ADP2106-1.8
• Manufacturer: Analog Devices Inc

Specifications of ADP2106-1.8-EVALZ

• Main Purpose: DC/DC, Step Down
• Outputs And Type: 1, Non-Isolated
• Voltage - Output: 1.8V
• Current - Output: 1.5A
• Voltage - Input: 2.7 ~ 5.5V
• Regulator Topology: Buck
• Frequency - Switching: 1.2MHz
• Board Type: Fully Populated
• Utilized Ic / Part: ADP2106
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power - Output: -

OUTLINE DIMENSIONS
ORDERING GUIDE
Model
ADP2105ACPZ-1.2-R7
ADP2105ACPZ-1.5-R7
ADP2105ACPZ-1.8-R7
ADP2105ACPZ-3.3-R7
ADP2105ACPZ-R7
ADP2106ACPZ-1.2-R7
ADP2106ACPZ-1.5-R7
ADP2106ACPZ-1.8-R7
ADP2106ACPZ-3.3-R7
ADP2106ACPZ-R7
ADP2107ACPZ-1.2-R7
ADP2107ACPZ-1.5-R7
ADP2107ACPZ-1.8-R7
ADP2107ACPZ-3.3-R7
ADP2107ACPZ-R7
ADP2105-1.8-EVALZ
ADP2105-EVALZ
ADP2106-1.8-EVALZ
ADP2106-EVALZ
ADP2107-1.8-EVALZ
ADP2107-EVALZ
1
Z = RoHS Compliant Part.
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
INDICATOR
Output
Current
1 A
1 A
1 A
1 A
1 A
1.5 A
1.5 A
1.5 A
1.5 A
1.5 A
2 A
2 A
2 A
2 A
2 A
1.00
0.85
0.80
PIN 1
12° MAX
SEATING
PLANE
Temperature
Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
BSC SQ
VIEW
4.00
TOP
Figure 61. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
COMPLIANT TO JEDEC STANDARDS MO-220-VGGC
0.80 MAX
0.65 TYP
0.35
0.30
0.25
BSC SQ
0.20 REF
4 mm × 4 mm Body, Very Thin Quad
3.75
Dimensions shown in millimeters
0.05 MAX
0.02 NOM
Rev. C | Page 33 of 36
Output Voltage
1.2 V
1.5 V
1.8 V
3.3 V
ADJ
1.2 V
1.5 V
1.8 V
3.3 V
ADJ
1.2 V
1.5 V
1.8 V
3.3 V
ADJ
1.8 V
Adjustable, but set to 2.5 V
1.8 V
Adjustable, but set to 2.5 V
1.8 V
Adjustable, but set to 2.5 V
0.65 BSC
COPLANARITY
0.60 MAX
(CP-16-10)
0.50
0.40
0.30
0.08
12
9
13
8
(BOTTOM VIEW)
1.95 BSC
EXPOSED
0.60 MAX
PAD
THE EXPOSED PAD ON THE
BOTTOM OF THE LFCSP PACKAGE
MUST BE SOLDERED TO PCB GROUND
FOR PROPER HEAT DISSIPATION AND
ALSO FOR NOISE AND MECHANICAL
STRENGTH BENEFITS.
16
5
1
4
0.25 MIN
2.50
2.35 SQ
2.20
ADP2105/ADP2106/ADP2107
Package Description
16-Lead LFCSP_VQ
16-Lead LFCSP_VQ
16-Lead LFCSP_VQ
16-Lead LFCSP_VQ
16-Lead LFCSP_VQ
16-Lead LFCSP_VQ
16-Lead LFCSP_VQ
16-Lead LFCSP_VQ
16-Lead LFCSP_VQ
16-Lead LFCSP_VQ
16-Lead LFCSP_VQ
16-Lead LFCSP_VQ
16-Lead LFCSP_VQ
16-Lead LFCSP_VQ
16-Lead LFCSP_VQ
Evaluation Board
Evaluation Board
Evaluation Board
Evaluation Board
Evaluation Board
Evaluation Board
PIN 1
INDICATOR
Package Option
CP-16-10
CP-16-10
CP-16-10
CP-16-10
CP-16-10
CP-16-10
CP-16-10
CP-16-10
CP-16-10
CP-16-10
CP-16-10
CP-16-10
CP-16-10
CP-16-10
CP-16-10