AC164001 Microchip Technology, AC164001 Datasheet - Page 7

• Manufacturer Part Number: AC164001
• Description: MODULE SKT PROMATEII 18/28DIP
• Manufacturer: Microchip Technology

Specifications of AC164001

• Module/board Type: Socket Module - DIP
• Processor To Be Evaluated: PIC 16
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: PRO MATE - II™/PRO MATE™
• For Use With: DV007003 - PROGRAMMER UNIVERSAL PROMATE II
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

The following table defines the acronyms for the microcontroller device packages.
Device Package Names:
DIP
SOIC
SSOP
PLCC
Socket Life Expectancy and Cleaning Procedures
PIC16C924
PIC16F83
PIC16F84
PIC17C42A
PIC17C43
PIC17C44
PIC17C756
Note: When using a 28-pin device in a 40-pin socket, align pin 1 to the pin 1 indicator (socket is top
justified). Shaded area indicates not applicable.
1997 Microchip Technology Inc.
Model Name/
Device #
Dual Inline Package
Small Outline Integrated Circuit
Shrink Small Outline Package
Plastic Leaded Chip Carrier
64/68
Count
40/44
40/44
40/44
68/64
Pin
18
18
AC164025
Microchip uses socket types from manufacturers including: Aries, AMP, 3M
Textool, and Yamaichi. Each socket module has different cleaning and
insertion times. Look at the socket module to determine the name of the
manufacturer. The Yamaichi socket is not labeled; identify a Yamaichi socket
by looking for the letters IC51- (as the prefix to a part number) on the socket.
Socket Life Expectancy
The expected life for manual insertions has been found to be less than the
manufacturer’s reported number. The number of manual insertions depends
on the socket condition and how often the socket is cleaned.
The following table gives the expected life (in number of automatic insertions)
for each socket module as reported by the manufacturer. The expected life of
a socket module is normally listed as the number of automatic insertions.
Careless insertions or dirty socket conditions can bring the number of
insertions down to less than 5,000. Cleanliness and care in inserting devices
into a socket are most important with surface mount devices as the socket
contactors must remain planar to function properly.
Any bent or non-planar contacts will result in a failure. Non-planar socket
module contacts occur earlier in the life of a socket module when devices are
inserted manually into a socket module. Early contact failure from manual
insertions is due to the non-repeatability of the manual insertion method.
AC164010
AC164010
AC174001
AC174001
AC174001
AC174009
DIP
AC164010
AC164010
SOIC
MQFP
ZIF
TQFP
Chapter 1. Socket Modules
Metric Quad Flat Pack
Zero Insertion Force
Thin Quad Flat Pack
SSOP
AC164022
AC174002
AC174002
AC174002
AC174007
PLCC
AC174004
AC174004
AC174004
MQFP
DS30243G - page 3
AC164023
AC174005
AC174005
AC174005
AC174008
TQFP