LTM4603IV-1#PBF Linear Technology, LTM4603IV-1#PBF Datasheet - Page 18

IC DC/DC UMODULE 6A 118-LGA

LTM4603IV-1#PBF

Manufacturer Part Number
LTM4603IV-1#PBF
Description
IC DC/DC UMODULE 6A 118-LGA
Manufacturer
Linear Technology
Series
µModuler
Type
Point of Load (POL) Non-Isolatedr
Datasheet

Specifications of LTM4603IV-1#PBF

Design Resources
LTM4603-1 Spice Model
Output
0.6 ~ 5 V
Number Of Outputs
1
Power (watts)
30W
Mounting Type
Surface Mount
Voltage - Input
4.5 ~ 20V
Package / Case
118-LGA
1st Output
0.6 ~ 5 VDC @ 6A
Size / Dimension
0.59" L x 0.59" W x 0.11" H (15mm x 15mm x 2.8mm)
Power (watts) - Rated
30W
Operating Temperature
-40°C ~ 85°C
Efficiency
93%
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
3rd Output
-
2nd Output
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LTM4603IV-1#PBF
Manufacturer:
LT
Quantity:
892
Company:
Part Number:
LTM4603IV-1#PBF
Manufacturer:
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Quantity:
20 000
LTM4603/LTM4603-1
APPLICATIONS INFORMATION
Safety Considerations
The LTM4603 modules do not provide isolation from V
V
with a rating twice the maximum input current needs to be
provided to protect each unit from catastrophic failure.
Layout Checklist/Example
The high integration of LTM4603 makes the PCB board
layout very simple and easy. However, to optimize its electri-
cal and thermal performance, some layout considerations
are still necessary.
• Use large PCB copper areas for high current path, in-
• Place high frequency ceramic input and output capaci-
• Place a dedicated power ground layer underneath the
• To minimize the via conduction loss and reduce module
18
OUT
cluding V
PCB conduction loss and thermal stress.
tors next to the V
high frequency noise.
unit.
thermal stress, use multiple vias for interconnection
between top layer and other power layers.
. There is no internal fuse. If required, a slow blow fuse
IN
, PGND and V
IN
, PGND and V
OUT
. It helps to minimize the
V
GND
V
OUT
IN
OUT
C
OUT
pins to minimize
C
IN
C
Figure 15. Recommended Layout
OUT
C
IN
IN
to
• Do not put vias directly on pads.
• If vias are placed onto the pads, the the vias must be
• Interstitial via placement can also be used if necessary.
• Use a separated SGND ground copper area for com-
Figure 15 gives a good example of the recommended
layout.
Frequency Adjustment
The LTM4603 is designed to typically operate at 1MHz
across most input conditions. The f
open or decoupled with an optional 1000pF capacitor. The
switching frequency has been optimized for maintaining
constant output ripple noise over most operating ranges.
The 1MHz switching frequency and the 400ns minimum
off time can limit operation at higher duty cycles like 5V
to 3.3V, and produce excessive inductor ripple currents for
lower duty cycle applications like 20V to 5V. The 5V and
3.3V drop out curves are modifi ed by adding an external
resistor on the f
operation, or higher input voltage operation.
capped.
ponents connected to signal pins. Connect the SGND
to PGND underneath the unit.
4603 F15
SET
SIGNAL
GND
pin to allow for lower input voltage
SET
pin is typically left
4603fa

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