ATA016A0X3Z Lineage Power, ATA016A0X3Z Datasheet - Page 16

CONVER DC/DC 0.75 5.5V @ 16A SIP

ATA016A0X3Z

Manufacturer Part Number
ATA016A0X3Z
Description
CONVER DC/DC 0.75 5.5V @ 16A SIP
Manufacturer
Lineage Power
Series
Austin SuperLynx™ IIr
Type
Point of Load (POL) Non-Isolated with Remote On/Offr
Datasheet

Specifications of ATA016A0X3Z

Output
0.75 ~ 5.5V
Number Of Outputs
1
Power (watts)
88W
Mounting Type
Through Hole
Voltage - Input
8.3 ~ 14V
Package / Case
11-SIP Module
1st Output
0.75 ~ 5.5 VDC @ 16A
Size / Dimension
2.00" L x 0.32" W x 0.50" H (50.8mm x 8.1mm x 12.7mm)
Power (watts) - Rated
88W
Operating Temperature
-40°C ~ 85°C
Efficiency
92%
Approvals
CSA, EN, UL, VDE
Output Power
88 W
Input Voltage Range
8.3 V to 14 V
Output Voltage (channel 1)
0.75 V to 5.5 V
Output Current (channel 1)
16 A
Package / Case Size
SIP
Output Type
Non-Isolated
Output Voltage
0.75 V to 5.5 V
Product
Non-Isolated / POL
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
3rd Output
-
2nd Output
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
555-1087
CC109104691

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ATA016A0X3Z
Manufacturer:
Lineage Power
Quantity:
135
Data Sheet
October 1, 2009
Post solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Board Mounted Power
Modules: Soldering and Cleaning Application Note.
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have an RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes.
A maximum preheat rate of 3 ° C/s is suggested. The
wave preheat process should be such that the
temperature of the power module board is kept below
210 ° C. For Pb solder, the recommended pot
temperature is 260 ° C, while the Pb-free solder pot is
270 ° C max. Not all RoHS-compliant through-hole
products can be processed with paste-through-hole
Pb or Pb-free reflow process. If additional information
is needed, please consult with your Lineage Power
technical representative for more details.
LINEAGE
POWER
8.3 – 14Vdc input; 0.75Vdc to 5.5Vdc Output;16A output current
Austin SuperLynx
TM
II 12V SIP Non-isolated Power Modules:
16

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