JC100A1 Lineage Power, JC100A1 Datasheet - Page 13

• Manufacturer Part Number: JC100A1
• Description: CONVERTER DC/DC 5V 100W OUT
• Manufacturer: Lineage Power
• Series: JC100r
• Type: Isolated with Remote On/Offr

Specifications of JC100A1

• Output: 5V
• Number Of Outputs: 1
• Power (watts): 100W
• Mounting Type: Through Hole
• Voltage - Input: 18 ~ 36V
• Package / Case: 9-DIP Module
• 1st Output: 5 VDC @ 20A
• Size / Dimension: 2.40" L x 2.28" W x 0.50" H (61mm x 57.9mm x 12.7mm)
• Power (watts) - Rated: 100W
• Operating Temperature: -40°C ~ 100°C
• Efficiency: 85%
• Approvals: CSA, UL, VDE
• Product: Isolated
• Output Power: 100 W
• Input Voltage Range: 18 V to 36 V
• Input Voltage (nominal): 28 V
• Output Voltage (channel 1): 5 V
• Output Current (channel 1): 20 A
• Isolation Voltage: 1.5 KV
• Package / Case Size: DIP
• Output Type: Isolated
• Output Voltage: 5 V
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• 3rd Output: -
• 2nd Output: -
• 4th Output: -
• Lead Free Status / Rohs Status: No

Thermal Considerations
Heat Transfer with Heat Sinks
The power modules have through-threaded, M3 x 0.5
mounting holes, which enable heat sinks or cold plates
to attach to the module. The mounting torque must not
exceed 0.56 N–m (5 in.–lb.). For a screw attachment
from the pin side, the recommended hole size on the
customer’s PWB around the mounting holes is
0.130 ± 0.005 inches. If a larger hole is used, the
mounting torque from the pin side must not exceed
0.25 N–m (2.2 in.–lb.).
Thermal derating with heat sinks is expressed by using
the overall thermal resistance of the module. Total
module thermal resistance (θca) is defined as the max-
imum case temperature rise (ΔT
module power dissipation (P
The location to measure case temperature (T
shown in Figure 23. Case-to-ambient thermal resis-
tance vs. airflow is shown, for various heat sink config-
urations and heights, in Figure 28. These curves were
obtained by experimental testing of heat sinks, which
are offered in the product catalog.
Figure 28. Case-to-Ambient Thermal Resistance
These measured resistances are from heat transfer
from the sides and bottom of the module as well as the
top side with the attached heat sink; therefore, the
case-to-ambient thermal resistances shown are gener-
ally lower than the resistance of the heat sink by itself.
The module used to collect the data in Figure 28 had a
θ
ca
8
7
6
5
4
3
2
1
0
March 2008
Lineage Power
0
=
Curves; Either Orientation
ΔT
-------------------- -
AIR VELOCITY MEASURED IN m/s (ft./min.)
(100)
0.5
P
C max
,
D
(200)
1.0
=
(
----------------------- -
T
D
C
(300)
):
P
1.5
–
D
C, max
T
1 1/2 IN HEAT SINK
1 IN HEAT SINK
1/2 IN HEAT SINK
1/4 IN HEAT SINK
NO HEAT SINK
A
(continued)
)
(400)
) divided by the
2.0
(500)
2.5
C
) is
(600)
3.0
8-1153
18 Vdc to 36 Vdc Input, 5 Vdc Output; 50 W to 100 W
thermal-conductive dry pad between the case and the
heat sink to minimize contact resistance. The use of
Figure 28 is shown in the following example
Example
If an 85 °C case temperature is desired, what is the
minimum airflow necessary? Assume the JC100A
module is operating at nominal line and an output cur-
rent of 20 A, maximum ambient air temperature of
40 °C, and the heat sink is 0.5 in.
Solution
Given: V
Determine P
Then solve the following equation:
Use Figure 28 to determine air velocity for the 0.5 inch
heat sink.
The minimum airflow necessary for the JC100A mod-
ule is 2.0 m/s (400 ft./min.).
θ
θ
θ
ca
ca
ca
I
T
T
Heat sink = 0.5 in.
P
O
=
=
=
A
C
I
D
= 20 A
= 28 V
= 40 °C
= 85 °C
= 22.8 W
1.97
D
(
----------------------- -
(
----------------------- -
T
85 40
by using Figure 27:
C
P
°C/W
17
–
–
D
T
A
)
)
13