HLMP-1790-A00A1 Avago Technologies US Inc., HLMP-1790-A00A1 Datasheet - Page 9

• Manufacturer Part Number: HLMP-1790-A00A1
• Description: LED 3MM GAP DIFF GRN RA HOUSING
• Manufacturer: Avago Technologies US Inc.

Specifications of HLMP-1790-A00A1

• Color: Green
• Voltage Rating: 1.9V
• Current: 2mA
• Lens Type: Diffused, Red Tinted
• Lens Style/size: Round, 3mm, T-1
• Configuration: Single
• Mounting Type: Through Hole, Right Angle
• Led Size: T-1
• Illumination Color: Green
• Lens Color/style: Tinted Diffused
• Operating Voltage: 1.9 V
• Wavelength: 569 nm
• Luminous Intensity: 2.3 mcd
• Operating Current: 2 mA
• Lens Dimensions: 3 mm
• Lens Shape: Dome
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 20 C
• Mounting Style: Through Hole
• Viewing Angle: 50 deg
• Package / Case: T-1
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 516-1758; HLMP-1790-A00A1

Packaging Label:
(i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box)
Example of Wave Soldering Temperature Profile for TH LED
9
(1P) PART #: Part Number
(1T) LOT #: Lot Number
(9D)MFG DATE: Manufacturing Date
(1T) Lot: Lot Number
LPN:
(9D)MFG Date: Manufacturing Date
(P) Customer Item:
DeptID:
250
(1P) Item: Part Number
(V) Vendor ID:
200
150
100
50
0
Lamps Baby Label
10
20
30
PREHEAT
TURBULENT WAVE
40
TIME (MINUTES)
Made In: Country of Origin
(9D) Date Code: Date Code
50
STANDARD LABEL LS0002
RoHS Compliant
e3
(Q) QTY: Quantity
BIN: Color Bin
CAT: Intensity Bin
60
QUANTITY: Packing Quantity
RoHS Compliant
e3
max temp 250C
70
max temp 250C
LAMINAR
80
HOT AIR KNIFE
90
100
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak temperature = 250°C)
Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec)
Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak temperature = 250°C)
Dwell time: 1.5 sec – 3.0 sec (maximum = 3sec)
Note: Allow for board to be sufficiently cooled to
room temperature before exerting mechanical force.