TLP3063(TP1,S,C,F,T Toshiba, TLP3063(TP1,S,C,F,T Datasheet - Page 9

• Manufacturer Part Number: TLP3063(TP1,S,C,F,T
• Description: PHOTOCOUPLER TRIAC OUT 6-SMD
• Manufacturer: Toshiba

Specifications of TLP3063(TP1,S,C,F,T

• Voltage - Isolation: 5000Vrms
• Number Of Channels: 1
• Voltage - Off State: 600V
• Output Type: AC, Triac, Zero Cross
• Current - Gate Trigger (igt) (max): 5mA
• Current - Hold (ih): 600µA
• Current - Dc Forward (if): 20mA
• Current - Output / Channel: 100mA
• Mounting Type: Surface Mount
• Package / Case: 6-SMD (300 mil, 5 Leads)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: TLP3063(TP1,S,C,F); TLP3063(TP1,SC,F,T); TLP3063TP1SCFTTR; TLP3063TP1SFTR; TLP3063TP1SFTR

Photocoupler Product Tree
3
DIP8
Package
Photocoupler Product Tree
DIP4
Photorelays
Photorelays
2.54SOP4
Triac Output
Thyristor- and Triac-Output
DIP16
SOP4
SO8
2.54SOP6
ZC
DIP6
Transistor-Output
Thyristor Output
SDIP6
SO6
SO16
SOP16
MFSOP6
2.54SOP8
SSOP4
USOP4
Transistor-Output
Output Choices
2.54SOP4
2.54SOP8
MFSOP6
SSOP4
USOP4
SOP16
SDIP6
SOP4
SO16
DIP4
DIP8
SO6
SO8
9
Darlington-Transistor Output
Photovoltaic-Output
Photovoltaic-Output
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●
●
●
●
●
●
●
●
●
●
●
2.54SOP6
≥ 7-mm clearance/creepage; ≥ 0.4-mm isolation thickness
6-pin SMD package (1.27-mm lead pitch)
≥ 5-mm clearance/creepage; ≥ 0.4-mm isolation thickness
5-pin SMD package (1.27-mm lead pitch); low-profile
8-pin SMD package (1.27-mm lead pitch)
16-pin SMD package (1.27-mm lead pitch)
4-pin SMD package (1.27-mm lead pitch)
16-pin SMD package (1.27-mm lead pitch)
SMD package (1.27-mm lead pitch)
SMD package (2.54-mm lead pitch)
Ultra-small; SMD package (1.27-mm lead pitch)
Ultra-small; SMD package (1.27-mm lead pitch)
DIP16
DIP6
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General-purpose packages
Lead-forming options for surface mounting
Logic Output
Gate Drive
IC-Output
GND
GND
Vcc
V
CC