HCPL-817 Avago Technologies US Inc., HCPL-817 Datasheet - Page 4

• Manufacturer Part Number: HCPL-817
• Description: OPTOCOUPLER TRANS-OUT 4-DIP
• Manufacturer: Avago Technologies US Inc.

Specifications of HCPL-817

• Number Of Channels: 1
• Input Type: DC
• Voltage - Isolation: 5000Vrms
• Current Transfer Ratio (min): 50% @ 5mA
• Current Transfer Ratio (max): 600% @ 5mA
• Voltage - Output: 70V
• Current - Output / Channel: 50mA
• Current - Dc Forward (if): 50mA
• Vce Saturation (max): 200mV
• Output Type: Transistor
• Mounting Type: Through Hole
• Package / Case: 4-DIP (0.300", 7.62mm)
• No. Of Channels: 1
• Isolation Voltage: 5kV
• Optocoupler Output Type: Phototransistor
• Input Current: 20mA
• Output Voltage: 70V
• Opto Case Style: DIP
• No. Of Pins: 4
• Peak Reflow Compatible (260 C): No
• Ctr Min: 50%
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: 516-1006-5

HCPL-817-300E
LEAD FREE
Solder Reflow Temperature Profile
Note: Non-halide flux should be used.
Absolute Maximum Ratings (T
Storage Temperature, T
Operating Temperature, T
Lead Solder Temperature, max.
(1.6 mm below seating plane)
Average Forward Current, I
Reverse Input Voltage, V
Input Power Dissipation, P
Collector Current, I
Collector-Emitter Voltage, V
Emitter-Collector Voltage, V
Collector Power Dissipation
Total Power Dissipation
Isolation Voltage, V
4
25 ° C
ANODE
150 ° C
DIMENSIONS IN MILLIMETERS AND (INCHES)
A 817
60 ~ 150 sec
Y W W
C
iso
(AC for 1 minute, R.H. = 40 ~ 60%)
S
200 ° C
R
A
I
A
F
6.5 ± 0.5
CEO
ECO
217 ° C
(0.256)
= 25˚C)
Time (sec)
RANK
250 ° C
DATE CODE
90 sec
60 sec
1.2 ± 0.1
(0.047)
260 ° C (Peak Temperature)
30 seconds
60 sec
2.54 ± 0.25
4.6 ± 0.5
(0.181)
(0.1)
–55˚C to +125˚C
–30˚C to +100˚C
260˚C for 10 s
50 mA
6 V
70 mW
50 mA
70 V
6 V
150 mW
200 mW
5000 Vrms
3.5 ± 0.5
(0.138)
0.35 ± 0.25
1) One-time soldering reflow is recommended
2) When using another soldering method such
(0.014)
within the condition of temperature and time
profile shown.
as infrared ray lamp, the temperature may
rise partially in the mold of thedevice. Keep
the temperature on the package of the device
within the condition of (1) above.
1.0 ± 0.25
(0.039)
10.16 ± 0.3
7.62 ± 0.3
(0.3)
(0.4)
(0.010)
0.26