TLP126(F) Toshiba, TLP126(F) Datasheet - Page 66

• Manufacturer Part Number: TLP126(F)
• Description: PHOTOCPLR AC-IN TRANS-OUT 4-SMD
• Manufacturer: Toshiba

Specifications of TLP126(F)

• Number Of Channels: 1
• Input Type: AC, DC
• Voltage - Isolation: 3750Vrms
• Current Transfer Ratio (min): 100% @ 1mA
• Current Transfer Ratio (max): 1200% @ 1mA
• Voltage - Output: 80V
• Current - Output / Channel: 50mA
• Current - Dc Forward (if): 50mA
• Vce Saturation (max): 400mV
• Output Type: Transistor
• Mounting Type: Surface Mount
• Package / Case: 4-SMD
• Configuration: 1
• Maximum Collector Emitter Voltage: 80 V
• Maximum Collector Emitter Saturation Voltage: 400 mV
• Isolation Voltage: 3750 Vrms
• Current Transfer Ratio: 1200 %
• Maximum Forward Diode Voltage: 1.3 V
• Minimum Forward Diode Voltage: 1 V
• Maximum Collector Current: 50 mA
• Maximum Power Dissipation: 200 mW
• Maximum Operating Temperature: + 75 C
• Minimum Operating Temperature: - 25 C
• Maximum Input Diode Current: 50 mA
• Output Device: Transistor
• No. Of Channels: 1
• Optocoupler Output Type: Phototransistor
• Input Current: 1.6mA
• Output Voltage: 80V
• Opto Case Style: Mini-Flat
• No. Of Pins: 4
• Approval Bodies: UL
• Rohs Compliant: Yes
• Number Of Elements: 1
• Forward Voltage: 1.3V
• Forward Current: 50mA
• Collector-emitter Voltage: 80V
• Package Type: MFSOP
• Collector Current (dc) (max): 50mA
• Power Dissipation: 200mW
• Collector-emitter Saturation Voltage: 0.4V
• Pin Count: 4
• Mounting: Surface Mount
• Operating Temp Range: -25C to 75C
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: TLP126F

10
Safety Standard Approvals for Photocouplers
The table above lists photocouplers and photorelays that have already been approved as of January 2011. The information herein is subject to change. For the latest
information, please contact your nearest Toshiba sales representative.
Construction
Mechanical
60747-5-2
VDE/TÜV
Certified
Devices
Ratings
(min)
DIN
Mechanical Construction
EN
Construction
Internal
Package
Isolation Clearance
Isolation Thickness
Isolation Creepage
Working Insulation
Internal Creepage
Highest Allowable
Safety Standard Approvals
Voltage (Viorm)
Triac/Thyrsitor
Overvoltage
Path (mm)
IC Output
Path (mm)
Transistor
(Viotm)
Output
Output
(mm)
(mm)
Max.
TLP2403
TLP2405
TLP2408
TLP2409
6000 Vpk
565 Vpk
(1 ch)
SO8
4.2
4.2
0.4
–
Transmissive Photocouplers with an Insulating Film in
Photo Detector Chip
TLP701
TLP705
TLP715
TLP716
TLP718
TLP719
8000 Vpk
890 Vpk
SDIP6
7.0
7.0
0.4
–
Single-Molded Packages
LED Chip
TLP701F
TLP705F
TLP715F
TLP716F
TLP718F
TLP719F
1140 Vpk
8000 Vpk
(F type)
SDIP6
8.0
8.0
0.4
–
Film
Coupling Medium
(Window)
TLP350H
TLP351H
TLP750
TLP751
TLP759
TLP620
TLP620-2
TLP620-4
TLP627
TLP627-2
TLP627-4
TLP731
TLP732
TLP360J
TLP361J
TLP363J
TLP3022(S)
TLP3023(S)
TLP3042(S)
TLP3043(S)
TLP3052(S)
TLP3062(S)
TLP3063(S)
TLP3064(S)
TLP3082(S)
TLP3762(S)
TLP3782(S)
TLP3783(S)
/8000 Vpk
6000 Vpk
890 Vpk
6.4/7.0
6.4/7.0
0.4/0.5
66
DIP
–
(DIN EN60747-5-2) (Continued)
Package
(Body)
Lead
TLP350HF
TLP351HF
TLP750F
TLP751F
TLP759F
TLP620F
TLP620F-2
TLP621F
TLP621F-2
TLP360JF
TLP361JF
TLP363JF
TLP3022F(S)
TLP3023F(S)
TLP3042F(S)
TLP3043F(S)
TLP3052F(S)
TLP3062F(S)
TLP3063F(S)
TLP3064F(S)
TLP3082F(S)
TLP3762F(S)
TLP3782F(S)
TLP3783F(S)
/8000 Vpk
1140 Vpk
6000 Vpk
(F type)
0.4/0.5
DIP
8.0
8.0
–
TLP105
TLP108
TLP114A
TLP116
TLP117
TLP2066
TLP165J
TLP166J
MFSOP6
/6000 Vpk
4000 Vpk
565 Vpk
Photo Detector Chip
4.0
4.0
–
–
Transmissive Photocouplers in
TLP109
TLP116A
TLP104
TLP151
TLP265J
TLP266J
Double-Molded Packages
6000 Vpk
707 Vpk
SO6
5.0
5.0
0.4
–
LED Chip
TLP733
TLP734
TLP781
TLP762J
TLP763J
TLP748J
/1130 Vpk
/8000 Vpk
6000 Vpk
890 Vpk
6.5/7.0
6.5/7.0
0.4/0.5
Coupling Medium
(Window)
DIP
4.0
TLP733F
TLP734F
TLP781F
TLP762JF
TLP763JF
TLP748JF
/1130 Vpk
/8000 Vpk
Package
(Body)
Lead
6000 Vpk
890 Vpk
(F type)
0.4/0.5
DIP
8.0
8.0
4.0