TLP2531(F) Toshiba, TLP2531(F) Datasheet - Page 9

• Manufacturer Part Number: TLP2531(F)
• Description: PHOTOCOUPLER DUAL 6N136 8-DIP
• Manufacturer: Toshiba

Specifications of TLP2531(F)

• Voltage - Isolation: 2500Vrms
• Number Of Channels: 2, Unidirectional
• Current - Output / Channel: 8mA
• Propagation Delay High - Low @ If: 300ns @ 16mA
• Current - Dc Forward (if): 25mA
• Input Type: DC
• Output Type: Open Collector
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.300", 7.62mm)
• Configuration: 2 Channel
• Current Transfer Ratio: 30 % (Typ)
• Maximum Baud Rate: 1 Mbps (Typ)
• Maximum Forward Diode Voltage: 1.7 V
• Maximum Reverse Diode Voltage: 5 V
• Maximum Power Dissipation: 45 mW
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 25 C
• Isolation Voltage: 2500 Vrms
• Maximum Continuous Output Current: 8 mA
• Maximum Forward Diode Current: 25 mA
• Output Device: Integrated Photo IC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: TLP2531; TLP2531; TLP2531F

Photocoupler Product Tree
3
DIP8
Package
Photocoupler Product Tree
DIP4
Photorelays
Photorelays
2.54SOP4
Triac Output
Thyristor- and Triac-Output
DIP16
SOP4
SO8
2.54SOP6
ZC
DIP6
Transistor-Output
Thyristor Output
SDIP6
SO6
SO16
SOP16
MFSOP6
2.54SOP8
SSOP4
USOP4
Transistor-Output
Output Choices
2.54SOP4
2.54SOP8
MFSOP6
SSOP4
USOP4
SOP16
SDIP6
SOP4
SO16
DIP4
DIP8
SO6
SO8
9
Darlington-Transistor Output
Photovoltaic-Output
Photovoltaic-Output
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●
●
●
●
●
●
●
●
●
●
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2.54SOP6
≥ 7-mm clearance/creepage; ≥ 0.4-mm isolation thickness
6-pin SMD package (1.27-mm lead pitch)
≥ 5-mm clearance/creepage; ≥ 0.4-mm isolation thickness
5-pin SMD package (1.27-mm lead pitch); low-profile
8-pin SMD package (1.27-mm lead pitch)
16-pin SMD package (1.27-mm lead pitch)
4-pin SMD package (1.27-mm lead pitch)
16-pin SMD package (1.27-mm lead pitch)
SMD package (1.27-mm lead pitch)
SMD package (2.54-mm lead pitch)
Ultra-small; SMD package (1.27-mm lead pitch)
Ultra-small; SMD package (1.27-mm lead pitch)
DIP16
DIP6
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General-purpose packages
Lead-forming options for surface mounting
Logic Output
Gate Drive
IC-Output
GND
GND
Vcc
V
CC