HCPL-J456#300 Avago Technologies US Inc., HCPL-J456#300 Datasheet - Page 8

OPTOCOUPLER 1MBD ALGAAS 8-SMD GW

HCPL-J456#300

Manufacturer Part Number
HCPL-J456#300
Description
OPTOCOUPLER 1MBD ALGAAS 8-SMD GW
Manufacturer
Avago Technologies US Inc.
Datasheet

Specifications of HCPL-J456#300

Output Type
Open Collector
Package / Case
8-SMD Gull Wing
Voltage - Isolation
3750Vrms
Number Of Channels
1, Unidirectional
Current - Output / Channel
15mA
Data Rate
1MBd
Propagation Delay High - Low @ If
200ns @ 10mA
Current - Dc Forward (if)
25mA
Input Type
DC
Mounting Type
Surface Mount, Gull Wing
Configuration
1 Channel
Isolation Voltage
3750 Vrms
Current Transfer Ratio
90 %
Maximum Propagation Delay Time
650 ns
Maximum Forward Diode Voltage
1.95 V
Minimum Forward Diode Voltage
1.2 V
Maximum Reverse Diode Voltage
3 V
Maximum Forward Diode Current
20 mA
Maximum Continuous Output Current
15 mA
Maximum Power Dissipation
145 mW
Maximum Operating Temperature
+ 100 C
Minimum Operating Temperature
- 40 C
Number Of Elements
1
Forward Voltage
1.95V
Forward Current
25mA
Output Current
15mA
Package Type
PDIP SMD
Operating Temp Range
-40C to 100C
Power Dissipation
145mW
Propagation Delay Time
650ns
Pin Count
8
Mounting
Surface Mount
Reverse Breakdown Voltage
3V
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HCPL-J456#300HCPL-J456
Manufacturer:
AVAGO
Quantity:
10 000
Company:
Part Number:
HCPL-J456#300HCPL-J456#500
Manufacturer:
AVAGO
Quantity:
7 300
Company:
Part Number:
HCPL-J456#300HCPL-J456-000E
Manufacturer:
AVAGO
Quantity:
10 000
Company:
Part Number:
HCPL-J456#300HCPL-J456-000E
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Company:
Part Number:
HCPL-J456#300HCPL-J456-300E
Manufacturer:
AVAGO
Quantity:
10 000
Solder Reflow Temperature Profile
Recommended Pb-Free IR Profile
8
TEMPERATURE
ROOM
T
T
smax
300
200
100
smin
25
T
T
0
p
L
0
NOTE: NON-HALIDE FLUX SHOULD BE USED.
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
NOTE: NON-HALIDE FLUX SHOULD BE USED.
* RECOMMENDED PEAK TEMPERATURE FOR WIDEBODY 400mils PACKAGE IS 245 °C
smax
217 °C
PREHEATING RATE 3 °C + 1 °C/–0.5 °C/SEC.
REFLOW HEATING RATE 2.5 °C ± 0.5 °C/SEC.
160 °C
150 °C
140 °C
150 - 200 °C
= 200 °C, T
t 25 °C to PEAK
60 to 180 SEC.
smin
PREHEAT
3 °C/SEC. MAX.
= 150 °C
t
s
50
RAMP-UP
* 260 +0/-5 °C
3 °C + 1 °C/–0.5 °C
150 °C, 90 + 30 SEC.
TIME
PREHEATING TIME
t
2.5 C ± 0.5 °C/SEC.
t
L
p
100
TIME (SECONDS)
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
15 SEC.
60 to 150 SEC.
RAMP-DOWN
6 °C/SEC. MAX.
245 °C
TEMP.
PEAK
150
SEC.
30
SEC.
30
50 SEC.
SOLDERING
200 °C
TIME
200
PEAK
TEMP.
240 °C
TIGHT
TYPICAL
LOOSE
230 °C
TEMP.
PEAK
250

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