HCPL-2232-300E Avago Technologies US Inc., HCPL-2232-300E Datasheet - Page 10

• Manufacturer Part Number: HCPL-2232-300E
• Description: OPTOCPLR LOG-OUT 2CH 5MBD GW SMD
• Manufacturer: Avago Technologies US Inc.

Specifications of HCPL-2232-300E

• Package / Case: 8-SMD Gull Wing
• Voltage - Isolation: 3750Vrms
• Number Of Channels: 2, Unidirectional
• Current - Output / Channel: 25mA
• Data Rate: 5MBd
• Propagation Delay High - Low @ If: 150ns @ 3mA
• Current - Dc Forward (if): 10mA
• Input Type: DC
• Output Type: Push-Pull, Totem-Pole
• Mounting Type: Surface Mount, Gull Wing
• Isolation Voltage: 3750 Vrms
• Maximum Continuous Output Current: 25 mA
• Maximum Fall Time: 0.007 us
• Maximum Forward Diode Current: 10 mA
• Output Device: Logic Gate Photo IC
• Configuration: 2 Channel
• Maximum Baud Rate: 5 MBd(Typ)
• Maximum Forward Diode Voltage: 1.7 V
• Maximum Reverse Diode Voltage: 5 V
• Maximum Power Dissipation: 294 mW
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• No. Of Channels: 2
• Optocoupler Output Type: Logic Gate
• Input Current: 1.8mA
• Output Voltage: 20V
• Opto Case Style: SMD
• No. Of Pins: 8
• Common Mode Ratio: 10K
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 516-1653-5

Recommended Operating Conditions
*The initial switching threshold is 1.6 mA or less. It is recommended that 2.2 mA be used to permit at least a 20% LED degradation guardband.
†The initial switching threshold is 1.8 mA or less. It is recommended that 2.5 mA be used to permit at least a 20% LED degradation guardband.
10
Absolute Maximum Ratings
Parameter
Power Supply Voltage
Forward Input Current (ON)
Forward Input Voltage (OFF)
Operating Temperature
Junction Temperature
Fan Out
Parameter
Storage Temperature
Operating Temperature
Average Forward Input Current
Peak Transient Input Current
Reverse Input Voltage
Average Output Current
Supply Voltage
Output Voltage
Total Package Power Dissipation
Output Power Dissipation
Lead Solder Temperature (Through Hole Parts Only)
Solder Reflow Temperature Profile
(Surface Mount Parts Only)
(≤ 1 µs Pulse Width, 300 pps)
(≤ 200 µs Pulse Width,
< 1% Duty Cycle)
HCPL-223X
HCNW22XX
HCNW22XX
HCPL-223X
HCNW22XX
Symbol
V
I
V
See Package Outline Drawings section
F(ON)
F(OFF)
T
T
N
Symbol
CC
I
260°C for 10 sec., up to seating plane
A
J
I
F(TRAN)
F(AVG)
V
P
T
T
V
V
P
I
CC
O
A
O
R
O
S
T
1.6 mm below seating plane
260°C for 10 sec.,
Min.
1.6*
1.8†
Min.
-0.5
-40
-40
-40
-55
4.5
0
-
See Figure 7
Max.
125
210
294
1.0
85
10
40
25
20
20
5
3
Max.
125
0.8
20
85
5
4
Units
mW
mA
mA
mA
°C
°C
A
V
V
V
TTL Loads
Units
mA
°C
°C
V
V
Note
1
1
1
1
1
2
1