ACPL-M61T-500E Avago Technologies US Inc., ACPL-M61T-500E Datasheet - Page 3

• Manufacturer Part Number: ACPL-M61T-500E
• Description: OPTOCOUPLER LOG-OUT 10MBD SO-5
• Manufacturer: Avago Technologies US Inc.
• Series: R²Coupler™r

Specifications of ACPL-M61T-500E

• Package / Case: 6-SOIC (0.173", 4.40mm Width) 5 Leads
• Voltage - Isolation: 3750Vrms
• Number Of Channels: 1, Unidirectional
• Current - Output / Channel: 50mA
• Data Rate: 10MBd
• Propagation Delay High - Low @ If: 46ns @ 6.5mA
• Current - Dc Forward (if): 20mA
• Input Type: DC
• Output Type: Open Collector
• Mounting Type: Surface Mount
• No. Of Channels: 1
• Optocoupler Output Type: Logic Gate
• Input Current: 15mA
• Output Voltage: 7V
• Opto Case Style: SOIC
• No. Of Pins: 5
• Isolation Voltage: 3.75kV
• Number Of Elements: 1
• Forward Voltage: 1.85V
• Forward Current: 20mA
• Output Current: 50mA
• Package Type: SOIC
• Operating Temp Range: -40C to 125C
• Power Dissipation: 85mW
• Propagation Delay Time: 75ns
• Pin Count: 5
• Mounting: Surface Mount
• Reverse Breakdown Voltage: 5V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 516-1979-2

Package Outline Drawings
ACPL-M61T Small Outline SO-5 Package (JEDEC MO-155)
Solder Reflow Temperature Profile
Note: Non-halide flux should be used.

TEMPERATURE
(0.173 ± 0.004)
(0.098 ± 0.004)
DIMENSIONS IN MILLIMETERS (INCHES)
* MAXIMUM MOLD FLASH ON EACH SIDE IS 0.15 mm (0.006)
NOTE: FLOATING LEAD PROTRUSION IS 0.15 mm (6 mils) MAX.
4.4 ± 0.1
2.5 ± 0.1
ROOM
(0.050)
1.27
300
200
100
BSC
(0.142 ± 0.004)
M61T
YWW
0
0
3.6 ± 0.1*
EE
PREHEATING RATE 3 ˚ C + 1 ˚ C/- 0.5 ˚ C/SEC.
REFLOW HEATING RATE 2.5 ˚ C ± 0.5 ˚ C/SEC.
160 ˚ C
150 ˚ C
140 ˚ C
(0.016 ± 0.002)
(0.004 ± 0.004)
0.102 ± 0.102
(0.276 ± 0.008)
0.4 ± 0.05
7.0 ± 0.2
50
(0.028)
3 ˚ C + 1 ˚ C/- 0.5 ˚ C
Extended Datecode
for lot tracking
0.71
150 ˚ C, 90 + 30 SEC.
CATHODE
PREHEATING TIME
MIN.
ANODE
2.5 ˚ C ± 0.5 ˚ C/SEC.
1
3
100
TIME (SECONDS)
MAX. LEAD COPLANARITY
= 0.102 (0.004)
TEMP.
PEAK
245 ˚ C
150
6
5
4
(0.008 ± 0.001)
0.20 ± 0.025
V
V
GND
SEC.
SEC.
CC
OUT
30
30
50 SEC.
7
o
SOLDERING
MAX.
200 ˚ C
TIME
200
PEAK
TEMP.
240 ˚ C
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230 ˚ C
250