IDT89HPES16T4AG2ZCAL8 IDT, Integrated Device Technology Inc, IDT89HPES16T4AG2ZCAL8 Datasheet - Page 15

• Manufacturer Part Number: IDT89HPES16T4AG2ZCAL8
• Description: IC PCI SW 16LANDE 4PORT 324FCBGA
• Manufacturer: IDT, Integrated Device Technology Inc

Specifications of IDT89HPES16T4AG2ZCAL8

• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: 89HPES16T4AG2ZCAL8

Thermal Considerations
Power Consumption
(and also listed below).
Table 12 (and also listed below).
tion that is relevant to the thermal performance of the PES16T4AG2 switch.
IDT 89HPES16T4AG2 Data Sheet
Typical power is measured under the following conditions: 25°C Ambient, 35% total link usage on all ports, typical voltages defined in Table 12
Maximum power is measured under the following conditions: 70°C Ambient, 85% total link usage on all ports, maximum voltages defined in
This section describes thermal considerations for the PES16T4AG2 (19mm
Number of active
Lanes per Port
4/4/4/4
8/4/4
Note: It is important for the reliability of this device in any user environment that the junction temperature not exceed the T
specified in Table 16. Consequently, the effective junction to ambient thermal resistance (
maintained below the value determined by the formula:
Given that the values of T
achieve the desired
provided in Table 16), thermal resistance of the chosen adhesive (
circuit board (number of layers and size of the board). As a general guideline, this device will not need a heat sink if the board has 8 or more
layers AND the board size is larger than 4"x12" AND airflow in excess of 0.5 m/s is available. It is strongly recommended that users perform
their own thermal analysis for their own board and system design scenarios.
θ
Symbol
JA(effective)
T
T
A(max)
J(max)
θ
θ
P
JC
JB
θ
JA
= (T
Watts
Watts
mA
mA
J(max)
Effective Thermal Resistance, Junction-to-Ambient
θ
1.0V
Core Supply
- T
Typ
0.41
0.41
413
413
JA
Thermal Resistance, Junction-to-Board
Thermal Resistance, Junction-to-Case
A(max)
is left up to the board or system designer, but in general, it can be achieved by adding the effects of
Table 16 Thermal Specifications for PES16T4AG2, 19x19 mm FCBGA324 Package
J(max)
Power Dissipation of the Device
)/P
1.1V
Max
Junction Temperature
Ambient Temperature
, T
905
905
1.0
1.0
Parameter
A(max)
, and P are known, the value of desired
1.0V
PCIe Analog
Typ
0.90
0.90
901
901
Table 15 PES16T4AG2 Power Consumption
Supply
1.1V
Max
1.06
1.06
963
963
15 of 30
2.5V
PCIe Analog
High Supply
Typ
0.28
0.28
110
110
θ
CS
Value
2
2.75V
16.8
10.1
2.87
Max
125
), that of the heat sink (
9.2
4.1
0.3
0.34
0.34
FCBGA324 package). The data in Table 16 below contains informa-
70
123
123
θ
1.0V
Typ
PCIe Termin-
0.36
0.18
JA
ation Supply
360
180
Units
becomes a known entity to the system designer. How to
Watts
o
o
o
o
o
C/W
C/W
C/W
C/W
C/W
o
o
C
C
θ
1.1V
Max
JA
0.47
0.24
429
215
) for the worst case scenario must be
θ
SA
), amount of airflow, and properties of the
3.3V
0.007
Typ
0.01
I/O Supply
2
2
Conditions
1 m/S air flow
2 m/S air flow
Zero air flow
Maximum
Maximum
Maximum
3.465V
0.007
Max
0.01
2
2
September 13, 2010
Power
Typ
1.96
1.78
J(max)
θ
Total
JC
(value
value
Power
Max
2.87
2.64