LM2675M-5.0/NOPB National Semiconductor, LM2675M-5.0/NOPB Datasheet - Page 23

• Manufacturer Part Number: LM2675M-5.0/NOPB
• Description: IC REG SIMPLE SWITCHER 8-SOIC
• Manufacturer: National Semiconductor
• Series: SIMPLE SWITCHER®r
• Type: Step-Down (Buck)r

Specifications of LM2675M-5.0/NOPB

• Internal Switch(s): Yes
• Synchronous Rectifier: No
• Number Of Outputs: 1
• Voltage - Output: 5V
• Current - Output: 1A
• Frequency - Switching: 260kHz
• Voltage - Input: 6.5 ~ 40 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Package: 8SOIC N
• Minimum Input Voltage: 8 V
• Maximum Input Voltage: 40 V
• Switching Frequency: 260(Typ) KHz
• Operating Supply Voltage: 6.5 to 40 V
• Maximum Output Current: 1 A
• Output Type: Fixed
• Output Voltage: 5 V
• Efficiency: 90(Typ) %
• Current, Input Bias: 85 nA
• Current, Output: 1 A
• Current, Supply: 2.5 mA
• Frequency, Oscillator: 260 kHz
• Package Type: SOIC
• Regulator Type: Buck (Step-Down)
• Temperature, Operating, Range: -40 to +125 °C
• Voltage, Input: 6.5 to 40 V
• Voltage, Output: 5 V
• Primary Input Voltage: 12V
• No. Of Outputs: 1
• Output Current: 1A
• No. Of Pins: 8
• Operating Temperature Range: -40°C To +125°C
• Msl: MSL 1 - Unlimited
• Current Rating: 1A
• Rohs Compliant: Yes
• For Use With: LM2675-5.0EVAL - EVALUATION BOARD FOR LM2675-5.0
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power - Output: -
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device
• Other names: *LM2675M-5.0; *LM2675M-5.0/NOPB; LM2675M-5.0; LM2675M5.0

Application Information
When using the adjustable version, special care must be
taken as to the location of the feedback resistors and the
associated wiring. Physically locate both resistors near the
IC, and route the wiring away from the inductor, especially an
open core type of inductor.
LLP PACKAGE DEVICES
The LM2675 is offered in the 16 lead LLP surface mount
package to allow for increased power dissipation compared
to the SO-8 and DIP.
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23
The Die Attach Pad (DAP) can and should be connected to
PCB Ground plane/island. For CAD and assembly guide-
lines
power.national.com.
refer
to Application
Note AN-1187
www.national.com
at
http://