SG3846DW Microsemi Analog Mixed Signal Group, SG3846DW Datasheet - Page 2

IC PWM CURRENT MODE 16SOIC

SG3846DW

Manufacturer Part Number
SG3846DW
Description
IC PWM CURRENT MODE 16SOIC
Manufacturer
Microsemi Analog Mixed Signal Group
Datasheet

Specifications of SG3846DW

Pwm Type
Current Mode
Number Of Outputs
2
Frequency - Max
500kHz
Voltage - Supply
8 V ~ 40 V
Buck
Yes
Boost
Yes
Flyback
No
Inverting
No
Doubler
No
Divider
No
Cuk
No
Isolated
No
Operating Temperature
0°C ~ 70°C
Package / Case
16-SOIC
Frequency-max
500kHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Duty Cycle
-
Rev 1.1a
Copyright
ABSOLUTE MAXIMUM RATINGS
Supply Voltage (+V
Collector Supply Voltage(V
Analog Inputs (Pins 3, 4, 5, 6, & 16) ...................... -0.3V to +V
Logic Input ........................................................... -0.3V to 5.5V
Soure/Sink Load current (continuous) .......................... 200mA
Source/Sink Load Current (peak, 200ns) ...................... 500mA
Reference Load Current .................................................. 30mA
Soft Start Sink Current ..................................................... 50mA
Note 1. Values beyond which damage may occur.
Note 2. Pin numbers refer to ceramic J package.
J Package:
N Package:
DW Package:
F Package:
L Package:
RECOMMENDED OPERATING CONDITIONS
Supply Voltage Range ............................................... 8V to 40V
Collector Supply Voltage Range ............................. 4.5V to 40V
Source/Sink Output Current (continuous) ...................... 100mA
Source/Sink Output Current (peak 200ns) .................... 200mA
Reference Load Current ........................................... 0 to 10mA
Oscillator Frequency Range ........................... 1KHz to 500KHz
Note 3. Range over which the device is functiona
ELECTRICAL CHARACTERISTICS
(Unless otherwise specified, these specifications apply over the operating ambient temperatures for SG1846/SG1847 with -55 C T
with -25 C
case temperatures equal to the ambient temperature.)
THERMAL DATA
Reference Section
Output Voltage
Line Regulation
Load Regulation
Temperature Stability
Total Output Variation
Output Noise Voltage
Long Term Stability
Short Circuit Output Current
Thermal Resistance-
Thermal Resistance-
Thermal Resistance-
Thermal Resistance-
Thermal Resistance-
Thermal Resistance-
Thermal Resistance-
Thermal Resistance-
Thermal Resistance-
Thermal Resistance-
1994
T
A
Parameter
85 C, SG3846 with 0 C
IN
) .......................................................... 40V
(Note 4)
Junction to Case
Junction to Ambient
Junction to Case
Junction to Ambient
Junction to Case
Junction to Ambient
Junction to Case
Junction to Ambient
Junction to Case
Junction to Ambient
(Note 4)
(Note 4)
(Note 4)
C
) .............................................. 40V
,
,
,
,
,
T
V
I
Line, Load and Temperature
10Hz
T
V
L
(Note 1 and 2)
T
J
J
IN
REF
= 1mA to 10mA
A
JC
,
JC
,
JC
,
JC
,
JC
,
= 25°C, I
= 125°C, 1000Hrs.
= 8V to 40V
.................. 30°C/W
.................. 40°C/W
................... 40°C/W
.................. 70°C/W
.................. 35°C/W
= 0V
JA
JA
JA
JA
JA
70 C, +V
l.
.............. 80°C/W
............. 65°C/W
............. 95°C/W
........... 115°C/W
........... 120°C/W
f
10KHz. T
O
= 1mA
IN
(Note 3)
Test Conditions
= 15V. Low duty cycle pulse testing techniques are used which maintains junction and
J
= 25°C
IN
2
Note A. Junction Temperature Calculation: T
Note B. The above numbers for
RoHS Peak Package Solder Reflow Temp. (40 sec. max. exp.) .. 260° (+0, -5)
Sync Output Current ........................................................... 5mA
Error Amplifier Output Current ............................................ 5mA
Oscillator Charging current (Pin 9) ..................................... 5mA
Operating Junction Temperature
Storage Temperature Range ............................ -65°C to 150°C
Lead Temperature (Soldering, 10 Seconds) .................. 300°C
Oscillator Timing Resistor (R
Oscillator Timing Capacitor (C
Operating Ambient Temperature Range
SG1846 ........................................................... -55°C to 125°C
SG2846 ............................................................. -25°C to 85°C
SG3846 ................................................................ 0°C to 70°C
Hermetic (J, L, F Packages) ........................................ 150°C
Plastic (N, DW Package) ............................................. 150°C
thermal resistance of the package in a standard mount-
ing configuration. The
guidelines for the thermal performance of the device/pc-
board system. All of the above assume no ambient
airflow.
Min. Typ. Max.
5.05
5.00
-10
SG1846
SG2846
5.10
100
-45
0.4
5
3
5
11861 Western Avenue
T
) ........................... 2K
JC
T
5.15
5.20
) .................... 1000 pF to 0.1µF
20
15
are maximums for the limiting
JA
numbers are meant to be
Min. Typ. Max.
5.00
4.95
(714) 898-8121
-10
J
SG3846
= T
5.10
100
0.4
-45
A
5
3
5
Garden Grove, CA 92841
+ (P
A
125 C, SG2846
5.20
5.25
D
SG1846
20
15
FAX: (714) 893-2570
x
to 100K
JA
).
mV/°C
Units
mV
mV
mV
mA
µV
V
V

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