MAX6633MSA+T Maxim Integrated Products, MAX6633MSA+T Datasheet - Page 12

• Manufacturer Part Number: MAX6633MSA+T
• Description: IC TEMP SENSOR SMBUS 8-SOIC
• Manufacturer: Maxim Integrated Products

Specifications of MAX6633MSA+T

• Function: Temp Monitoring System (Sensor)
• Topology: ADC, Register Bank
• Sensor Type: Internal
• Sensing Temperature: -55°C ~ 150°C
• Output Type: I²C™/SMBus™
• Output Alarm: Yes
• Output Fan: Yes
• Voltage - Supply: 3 V ~ 5.5 V
• Operating Temperature: -55°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Full Temp Accuracy: +/- 2.5 C
• Digital Output - Bus Interface: Serial (3-Wire, I2C)
• Digital Output - Number Of Bits: 12 bit + Sign
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 55 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

and the serial interface. Enter shutdown by program-
ming the shutdown bit of the Configuration register
high. While in shutdown, the Temperature register
retains the last conversion result and can be read at
any time. The ADC is turned off, reducing the device
current draw to 30µA (max). The outputs of ALERT and
OVERT are latched upon entering shutdown, and the
fault queue is held in reset. After coming out of shut-
down, the Temperature register continues to read the
last converted temperature, until the next conversion
result is available.
The MAX6633/MAX6634/MAX6635 supply current is
typically 200µA when the serial interface is inactive.
When used to drive high-impedance loads, the devices
dissipate negligible power; therefore, the die tempera-
ture is essentially the same as the package tempera-
ture. The key to accurate temperature monitoring is
good thermal contact between the MAX6633/MAX6634/
MAX6635 package and the monitored device or circuit.
Heat flows in and out of plastic packages primarily
through the leads. Short, wide copper traces leading to
the temperature monitor ensure that heat transfers
quickly and reliably. The rise in die temperature due to
self-heating is given by the following formula:
where P
MAX6633/MAX6634/MAX6635, and θ
age’s thermal resistance.
The typical thermal resistance is 170°C/W for the 8-pin
SO package. To limit the effects of self-heating, mini-
mize the output currents. For example, if the
MAX6634/MAX6635 sink 4mA with the maximum
ALERT V
power is dissipated within the IC. This corresponds to a
0.54°C rise in the die temperature.
Figure 10 shows the MAX6634 used as a simple thermo-
stat to control a heating element. Figure 11 shows the
MAX6635 used as a temperature-triggered fan controller.
TRANSISTOR COUNT: 12,085
PROCESS: BiCMOS
12-Bit Plus Sign Temperature Sensors with
SMBus/I
12
______________________________________________________________________________________
DISSIPATION
L
specification of 0.8V, an additional 3.2mW of
ΔT
Applications Information
J
= P
2
C-Compatible Serial Interface
is the power dissipated by the
DISSIPATION
Thermal Considerations
Chip Information
x θ
JA
JA
is the pack-
Table 1. Address Selection
GND
GND
GND
GND
GND
GND
GND
GND
V
V
V
V
V
V
V
V
A3
CC
CC
CC
CC
CC
CC
CC
CC
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
V
V
V
V
V
V
V
V
V
V
V
V
A2
A2
CC
CC
CC
CC
CC
CC
CC
CC
CC
CC
CC
CC
MAX6633
MAX6634
MAX6635
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
V
V
V
V
V
V
V
V
V
V
V
V
V
V
A1
A1
A1
CC
CC
CC
CC
CC
CC
CC
CC
CC
CC
CC
CC
CC
CC
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
V
V
V
V
V
V
V
V
V
V
V
V
V
V
A0
A0
A0
CC
CC
CC
CC
CC
CC
CC
CC
CC
CC
CC
CC
CC
CC
ADDRESS
ADDRESS
ADDRESS
1000 001
1000 011
1000 101
1000 111
1001 001
1001 011
1001 101
1001 111
1001 001
1001 011
1001 101
1001 111
1001 001
1001 011
1000 000
1000 010
1000 100
1000 110
1001 000
1001 010
1001 100
1001 110
1001 000
1001 010
1001 100
1001 110
1001 000
1001 010