MAX6697UP9C+ Maxim Integrated Products, MAX6697UP9C+ Datasheet - Page 16

IC TEMP MON 7CH PREC 20TSSOP

MAX6697UP9C+

Manufacturer Part Number
MAX6697UP9C+
Description
IC TEMP MON 7CH PREC 20TSSOP
Manufacturer
Maxim Integrated Products
Datasheet

Specifications of MAX6697UP9C+

Function
Temp Monitoring System (Sensor)
Topology
ADC, Buffer, Register Bank
Sensor Type
External & Internal
Sensing Temperature
-40°C ~ 125°C, External Sensor
Output Type
I²C™/SMBus™
Output Alarm
Yes
Output Fan
Yes
Voltage - Supply
3 V ~ 5.5 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
20-TSSOP
Full Temp Accuracy
+/- 3 C
Digital Output - Bus Interface
Serial (2-Wire)
Digital Output - Number Of Bits
11 bit
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Table 11 shows the MAX6697 slave addresses.
The integrating ADC has good noise rejection for low-
frequency signals such as power-supply hum. In envi-
ronments with significant high-frequency EMI, connect
an external 2200pF capacitor between DXP_ and
DXN_. Larger capacitor values can be used for added
filtering, but do not exceed 3300pF because it can
introduce errors due to the rise time of the switched
current source. High-frequency noise reduction is
needed for high-accuracy remote measurements.
Noise can be reduced with careful PCB layout as dis-
cussed in the PCB Layout section.
7-Channel Precision Temperature Monitor
Table 10. Remote-Sensors Transistor
Manufacturer
Note: Discrete transistors must be diode connected (base
shorted to collector).
Table 11. Slave Address
16
Central Semiconductor (USA)
Rohm Semiconductor (USA)
Samsung (Korea)
Siemens (Germany)
Zetex (England)
MAX6697EP9C
MAX6697UP9C
MAX6697UP34
MAX6697UP38
MAX6697UP99
MAX6697EP34
MAX6697EP38
MAX6697EP99
______________________________________________________________________________________
PART
MANUFACTURER
SMBus SLAVE ID
0011 010
0011 100
1001 100
1001 110
0011 010
0011 100
1001 100
1001 110
ADC Noise Filtering
CMPT3904
SST3904
KST3904-TF
SMBT3904
FMMT3904CT-ND
Slave Address
MODEL NO.
PIN-PACKAGE
20 TSSOP
20 TSSOP
20 TSSOP
20 TSSOP
20 QSOP
20 QSOP
20 QSOP
20 QSOP
Follow these guidelines to reduce the measurement
error when measuring remote temperature:
1) Place the MAX6697 as close as is practical to the
2) Do not route the DXP-DXN lines next to the deflec-
3) Route the DXP and DXN traces in parallel and in
4) Route through as few vias and crossunders as pos-
5) Use wide traces when practical.
6) When the power supply is noisy, add a resistor (up
Figure 5. Recommended DXP-DXN PCB Traces
10 mils
10 mils
remote diode. In noisy environments, such as a
computer motherboard, this distance can be 4in to
8in (typ). This length can be increased if the worst
noise sources are avoided. Noise sources include
CRTs, clock generators, memory buses, and PCI
buses.
tion coils of a CRT. Also, do not route the traces
across fast digital signals, which can easily intro-
duce +30°C error, even with good filtering.
close proximity to each other. Each parallel pair of
traces should go to a remote diode. Route these
traces away from any higher voltage traces, such as
+12VDC. Leakage currents from PCB contamination
must be dealt with carefully since a 20MΩ leakage
path from DXP to ground causes about +1°C error.
If high-voltage traces are unavoidable, connect
guard traces to GND on either side of the DXP-DXN
traces (Figure 5).
sible to minimize copper/solder thermocouple
effects.
to 47Ω) in series with V
GND
GND
DXP
DXN
CC
.
PCB Layout
10 mils
MINIMUM
10 mils

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