MAX16051ETI+ Maxim Integrated Products, MAX16051ETI+ Datasheet - Page 7

• Manufacturer Part Number: MAX16051ETI+
• Description: IC POWER MONITR/SEQUENCER 28TQFN
• Manufacturer: Maxim Integrated Products

Specifications of MAX16051ETI+

• Applications: Power Supply Monitor, Sequencer
• Voltage - Supply: 2.7 V ~ 13.2 V
• Current - Supply: 700µA
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 28-TQFN Exposed Pad
• Supply Voltage (max): 13.2 V
• Supply Voltage (min): 2.7 V
• Supply Current (typ): 1.1 mA
• Mounting Style: SMD/SMT
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Input: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

MAX16050
18
19
20
21
22
23
24
25
26
27
28
—
—
—
—
PIN
MAX16051
Voltage Monitors/Sequencer Circuits with
18
19
20
21
22
23
24
—
—
—
28
25
26
27
—
_______________________________________________________________________________________
TIMEOUT
OV_OUT
CP_OUT
RESET
FAULT
DELAY
NAME
DISC5
SHDN
OUT5
SEQ1
SEQ2
SEQ3
SET1
SET5
EP
Set Monitored Threshold 1 Input. Monitor a voltage by setting the threshold with an
external resistive divider. The SET1 threshold is 0.5V.
Open-Drain Overvoltage Output. When any of the SET_ voltages exceed their 0.55V
overvoltage threshold, OV_OUT goes low. When all of the SET_ voltages are below their
overvoltage threshold, OV_OUT goes high impedance after a short propagation delay.
Open-Drain Reset Output. When any of the monitored voltages (including EN) falls below
its threshold, SHDN is pulled low, or FAULT is pulled low, RESET asserts and stays
asserted for at least the minimum reset timeout period after all of these conditions are
removed. The reset timeout is 128ms (typ) when TIMEOUT is connected to ABP or can be
adjusted by connecting a capacitor from TIMEOUT to GND.
FAULT Synchronization Input/Output. While EN = SHDN = high, FAULT is pulled low when
any of the SET_ voltages falls below their respective threshold. Pull FAULT low manually to
assert a simultaneous power-down. FAULT is internally pulled up to ABP by a 100kΩ
resistor.
Active-Low Shutdown Input. When SHDN is pulled low, the device will reverse sequence
for power-down operation. SHDN is internally pulled up to ABP by a 100kΩ resistor.
Adjustable Sequence Delay Timing Input. Connect a capacitor from DELAY to GND to set
the sequence delay between each OUT_. Leave DELAY unconnected for a 10µs (typ)
delay.
Adjustable Reset Timeout Input. Connect a capacitor from TIMEOUT to GND to set the
reset timeout period. Connect TIMEOUT to ABP for the fixed timeout of 128ms (typ). Leave
TIMEOUT unconnected for a 10µs (typ) delay.
Sequence Order Select Inputs. SEQ1, SEQ2, and SEQ3 allow the order of sequencing for
each supply to be programmable (Table 1).
Charge-Pump Output. An internal charge pump boosts CP_OUT to (V
a pullup voltage that can be used to drive external n-channel MOSFETs. CP_OUT sources
up to 25µA.
Discharge Pulldown Input 5. During normal operation, DISC5 is high impedance. During a
fault condition or power-down, DISC5 provides an 85mA sink current.
Open-Drain Output 5. When the voltage at SET4 is above 0.5V, OUT5 goes high
impedance. OUT5 requires an external pullup resistor and can be pulled up to 13.2V.
External Set Monitored Threshold 5. Monitor a voltage by setting the threshold with an
external resistive divider. The SET5 threshold is 0.5V.
Exposed Pad. EP is internally connected to GND. Connect EP to the GND plane for
improved heat dissipation. Do not use EP as the only ground connection.
Reverse-Sequencing Capability
FUNCTION
Pin Description (continued)
CC
+ 5V ) to provide
7