VNH2SP30-E STMicroelectronics, VNH2SP30-E Datasheet
VNH2SP30-E
Specifications of VNH2SP30-E
VNH2SP30
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VNH2SP30-E Summary of contents
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... Package: ECOPACK Description The VNH2SP30 full bridge motor driver intended for a wide range of automotive applications. The device incorporates a dual monolithic high side driver and two low side switches. The high side driver switch is designed using STMicroelectronic’s well known and proven ™ ...
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... Packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 2/33 Thermal calculation in clockwise and anti-clockwise operation in steady- state mode 26 Thermal resistances definition (values according to the PCB heatsink area) 26 Thermal calculation in transient mode . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Single pulse thermal impedance definition (values according to the PCB heatsink area VNH2SP30-E ...
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... VNH2SP30-E List of tables Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table 2. Block description Table 3. Pin definitions and functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Table 4. Pin functions description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Table 5. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Table 6. Power section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Table 7. Logic inputs (INA, INB, ENA, ENB Table 8. PWM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Table 9. Switching (V = 13V Table 10. Protection and diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Table 11. Current sense (9V < ...
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... Figure 42. MultiPowerSO-30 LSD thermal impedance junction ambient single pulse . . . . . . . . . . . . . 27 Figure 43. Thermal fitting model of an H-bridge in MultiPowerSO- Figure 44. MultiPowerSO-30 package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Figure 45. MultiPowerSO-30 suggested pad layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Figure 46. MultiPowerSO-30 tube shipment (no suffix Figure 47. MultiPowerSO-30 tape and reel shipment (suffix “TR” 4/33 VNH2SP30-E ...
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... VNH2SP30-E 1 Block diagram and pin description Figure 1. Block diagram CLAMP OUT A CLAMP GND A Table 2. Block description Name Logic control Overvoltage + undervoltage High side and low side clamp voltage High side and low side driver Linear current limiter Overtemperature protection Fault detection ...
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... Status of high side and low side switches B; open drain output Heat Slug2 Source of high side switch B / Drain of low side switch B B Source of low side switch A A Source of low side switch B B must be externally connected together. VNH2SP30-E 30 OUT A Nc OUT A GND A Heat Slug3 ...
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... VNH2SP30-E Table 4. Pin functions description Name V Battery connection CC GND , GND Power grounds; must always be externally connected together A B OUT , OUT Power connections to the motor A B Voltage controlled input pins with hysteresis, CMOS compatible. These two pins control the state of the bridge in normal operation according to the truth table (brake ...
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... STG 8/ DIAG / ENB DIAG / GND GND PWM ENA V ENB V pw Parameter and IN pins /EN and DIAG OUT , VNH2SP30 OUTA OUT A I OUTB OUT OUTA SENSE SENSE OUTB B GND I GND Value +41 30 -30 ±10 ±10 /EN pins ±10 -3/+ Internally limited -40 to 150 -55 to 150 V CC ...
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... VNH2SP30-E 2.2 Electrical characteristics -40°C < Table 6. Power section Symbol Parameter Operating supply V CC voltage I Supply current S Static high side R ONHS resistance Static low side R ONLS resistance High side free- V wheeling diode f forward voltage High side off state I output current L(off) (per channel) ...
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... Typ 1.2 4) 300 600 7) 110 = 25° 15A OUT Test conditions Min Typ 4 15A 43 48 OUT V = 3.25V 150 175 IN 135 7 15 VNH2SP30-E Max Unit 1.25 V µ µ Max Unit 20 kHz 250 250 µs 1.6 2.4 1800 ns 6 µs Max Unit 5 200 ...
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... VNH2SP30-E Table 11. Current sense (9V < V Symbol OUT OUT ( Analog sense current drift Analog sense current drift 2 2 Analog sense leakage I SENSEO current 1. Analog sense current drift is deviation of factor K for a given device over (-40°C to 150°C and 9V < V < 16V) with respect to its value measured Figure 4 ...
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... Electrical specifications Figure 5. Definition of the low side switching times Figure 6. Definition of the high side switching times V INA V OUTA 12/33 PWM V OUTA 20% t D(on) 90% VNH2SP30-E t 80 D(off) 10 ...
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... VNH2SP30-E Figure 7. Definition of dynamic cross conduction current during a PWM operation PWM I MOTOR V OUTB Electrical specifications 13/33 ...
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... DIAG /EN OUT OUT DIAG /EN DIAG / Fault Information VNH2SP30-E CS Operating mode B High Imp. Brake Clockwise (CW SENSE OUT Counterclockwise (CCW) High Imp. Brake to GND ) A OUT OUT OPEN L OPEN H L Protection Action Ω ...
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... VNH2SP30-E Table 14. Electrical transient requirements ISO T/R - 7637/1 Test pulse ISO T/R - 7637/1 test pulse ( For load dump exceeding the above value a centralized suppressor must be adopted. Class C E Test Level Test Level Test Level I II -25V -50V -75V +25V +50V +75V ...
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... Figure 13. Input low level voltage Vil (V) 2.75 2.5 2.25 1.75 1.5 1.25 100 125 150 175 VNH2SP30-E Off state supply current Vcc=13V - 100 125 Tc (°C) 8 Iin =1mA -50 - 100 125 150 Tc (° ...
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... VNH2SP30-E Figure 14. Input hysteresis voltage Vihyst (V) 2 1.75 Vcc=13V 1.5 1.25 1 0.75 0.5 0.25 0 -50 - (°C) Figure 16. Delay time during change of operation mode tdel (µs) 1000 900 800 700 600 500 400 300 200 100 0 -50 - (°C) Figure 18. High level enable voltage Venh (V) 3 ...
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... Figure 23. Overvoltage shutdown Vov (V) 30 27.5 25 22.5 20 17.5 15 12.5 10 100 125 150 175 Figure 25. Current limitation Ilim ( 100 125 150 175 -50 VNH2SP30-E Vcc=9V - 100 125 Tc (°C) -50 - 100 125 Tc (°C) - 100 125 Tc (°C) 150 175 150 175 150 175 ...
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... VNH2SP30-E Figure 26. On state high side resistance vs T case Ronhs (mOhm Vcc=9V; 16V Iout=15A -50 - (°C) Figure 28. Turn-On delay time td(on) (µs) 260 240 220 200 180 160 140 120 100 80 60 -50 - (°C) Figure 30. Output voltage rise time tr (µs) 2 1.8 1.6 1.4 1 ...
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... PWM OUT GND A S 100K G D /EN pin is considered as an output pin by the X X → overtemperature detection on high side A. → low side power MOSFET saturation detection. CC pin is considered as an input pin by the and LS A +5V CC DIAG / OUT GND MOSFET VNH2SP30-E switches ...
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... kHz PWM operation short circuit protection on page 3. a P-channel MOSFET connected to the V The device sustains no more than -30A in reverse battery conditions because of the two body diodes of the power MOSFETs. Additionally, in reverse battery condition the I/Os of VNH2SP30-E are pulled down to the DIAG /EN and DIAG ...
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... I/Os, the series resistor is: Figure 34. Half-bridge configuration DIAG /EN A DIAG /EN B PWM OUT A GND Note: The VNH2SP30-E can be used as a high power half-bridge driver achieving an On resistance per leg of 9.5mΩ. Figure 35. Multi-motors configuration DIAG /EN A DIAG /EN B PWM OUT A GND ...
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... VNH2SP30-E Figure 36. Waveforms in full bridge operation DIAG / DIAG / PWM OUT A OUT B I -> OUTA OUTB CS (*) (*) CS BEHAVIOR DURING PWM MODE WILL DEPEND ON PWM FREQUENCY AND DUTY CYCLE. NORMAL OPERATION (DIAG DIAG / DIAG / PWM OUT A OUT B I -> OUTA OUTB CS CURRENT LIMITATION/THERMAL SHUTDOWN or OUT ...
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... Application information Figure 37. Waveforms in full bridge operation (continued OUT A OUT B I -> OUTA OUTB DIAG / DIAG / normal 24/33 OUT shorted to V and undervoltage shutdown < nominal operation OUT shorted VNH2SP30-E undefined undefined normal operation undervoltage shutdown ...
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... VNH2SP30-E 4 Package and PCB thermal data 4.1 PowerSSO-30 thermal data Figure 38. MultiPowerSO-30™ PC board Note: Layout condition of R thickness = 2mm. Cu thickness = 35μm, Copper areas: from minimum pad layout to 2 16cm ). Figure 39. Chipset configuration Figure 40. Auto and mutual R condition and Z measurements (PCB FR4 area = 58mm x 58mm, PCB ...
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... Mutual Thermal Impedance Junction to Ambient thHSABLSB = Mutual Thermal Impedance Junction to Ambient between Low Side values set by user jLSA thHSLS dHSA thLSLS amb thLS thHSLS dHSB thLS amb thLSLS ( dLSB amb dLSB amb thLS dLSB amb VNH2SP30-E jLSB + P thHSLS dLSB amb + P thHSLS dLSA + T amb or A ...
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... VNH2SP30-E Equation 1: pulse calculation formula δ Z THδ Þ where δ ⁄ = Figure 41. MultiPowerSO-30 HSD thermal impedance junction ambient single pulse Figure 42. MultiPowerSO-30 LSD thermal impedance junction ambient single pulse THtp 1 δ – Package and PCB thermal data ZthHS ZthHSLS ZthLS ...
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... The blank space means that the value is the same as the previous one. 28/33 ( Footprint 0.05 0.3 0.5 1.3 14 44.7 0.2 0.4 0.8 1.5 20 46.9 115 0.005 0.008 0.01 0.3 0.6 5 0.003 0.006 0.075 2.5 VNH2SP30 39.1 31.6 23.7 36.1 30.4 20 3.5 4.5 5 ...
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... VNH2SP30-E 5 Package and packing information ® 5.1 ECOPACK In order to meet environmental requirements, ST offers these devices in ECOPACK packages. ECOPACK is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label ...
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... Table 17. MultiPowerSO-30 mechanical data Symbol Figure 45. MultiPowerSO-30 suggested pad layout 30/33 Millimeters Min Typ 1.85 0 0.42 0.23 17.1 17.2 18.85 15 5.55 4.6 9.6 0.8 0deg VNH2SP30-E Max 2.35 2.25 0.1 0.58 0.32 17.3 19.15 16.1 6.05 5.1 10.1 1.15 10deg 7deg ...
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... VNH2SP30-E 5.3 Packing information Note: The devices can be packed in tube or tape and reel shipments (see the page 1 for packaging quantities). Figure 46. MultiPowerSO-30 tube shipment (no suffix) C Figure 47. MultiPowerSO-30 tape and reel shipment (suffix “TR”) Package and packing information Dimension Base Q.ty A Bulk Q ...
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... ST products in automotive applications 6 Document reformatted and converted into new ST template. Corrected Heat Slug numbers in 7 functions. Added new infomation in 8 Added Figure 33: Behavior in fault condition (How a fault can be cleared) VNH2SP30-E Description of changes on page 1 ® to add ECOPACK package and I in INL INH to ...
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... VNH2SP30-E Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...