VNH3ASP30TR-E STMicroelectronics, VNH3ASP30TR-E Datasheet - Page 26

• Manufacturer Part Number: VNH3ASP30TR-E
• Description: IC DVR H BRIDGE 30A MULTIPWRSO30
• Manufacturer: STMicroelectronics
• Type: Half Bridge DC Motor Driverr

Specifications of VNH3ASP30TR-E

• Applications: Automotive
• Number Of Outputs: 2
• Current - Output: 30A
• Voltage - Supply: 5.5 V ~ 16 V
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: 30-MPSO, MultiPowerSO
• Operating Current: 10mA
• Operating Temperature Classification: Automotive
• Package Type: MultiPowerSO
• Operating Supply Voltage (min): 5.5V
• Operating Supply Voltage (max): 16V
• Supply Current: 10 mA
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Load: -
• Lead Free Status / Rohs Status: Compliant

Package and PCB thermal data
4.1.1
4.1.2
4.1.3
4.1.4
a.
26/33
Calculation is valid in any dynamic operating condition. P
Thermal calculation in clockwise and anti-clockwise operation in
Steady-state mode
Table 15.
Thermal resistances definition (values according to the PCB heatsink
area)
R
HS
R
R
between High-Side and Low-Side Chips
R
Chips
Thermal calculation in Transient mode
T
T
T
Single pulse thermal impedance definition (values according to the
PCB heatsink area)
Z
Z
Z
between High-Side and Low-Side Chips
Z
Chips
OFF
HS
ON
JHSAB
JLSA
JLSB
thHS
thLS
thHSLS
thLSLS
thHS
thLS
thHSLS
thLSLS
B
A
in ON state)
= Z
= High-Side Chip Thermal Impedance Junction to Ambient
HS
= R
= R
= Z
= Z
= Z
= Z
= R
= Z
= R
OFF
B
thLSA
ON
thHSA
thLSA
thHSLS
thHSLS
thHS
thLSALSB
thHSABLSA
LS
thLSALSB
thHSALSB
Thermal calculation in clockwise and anti-clockwise operation in Steady-
state mode
A
= Z
= R
= R
x P
x P
x P
OFF
LS
ON
thLSB
thLSB
thHSB
dHSAB
B
dHSAB
dHSAB
= Mutual Thermal Impedance Junction to Ambient between Low-Side
= Mutual Thermal Resistance Junction to Ambient between Low-Side
= R
= Z
P
x R
P
x R
= Low-Side Chip Thermal Impedance Junction to Ambient
dHSA
dHSB
= Low-Side Chip Thermal Resistance Junction to Ambient
= High-Side Chip Thermal Resistance Junction to Ambient (HS
thHSBLSA
thHSABLSB
thHSLS
thHSLS
+ Z
+ Z
+ Z
x R
x R
thHSLS
T
thLS
thLSLS
JHSAB
thHS
thHS
+ T
+ T
= Mutual Thermal Resistance Junction to Ambient
x P
A
A
= Mutual Thermal Impedance Junction to Ambient
+ P
+ P
x (P
d
x P
dLSA
values set by user.
dLSB
dLSA
dLSA
dLSA
+ Z
+ Z
P
P
P
P
+ P
thLSLS
dHSA
dLSB
dHSB
dLSA
thLS
dLSB
(a)
x R
x R
x R
x R
x P
x P
) + T
T
thLSLS
thLS
thHSLS
thHSLS
JLSA
dLSB
dLSB
+ T
A
+ T
+
+
+ T
+ T
A
A
A
A
P
x R
P
x R
dHSA
dHSB
thLS
thLSLS
x R
x R
+ T
VNH3ASP30-E
T
thHSLS
thHSLS
+ T
JLSB
A
A
+ P
+ P
dLSB
dLSA
A
or