NCV3066DR2G ON Semiconductor, NCV3066DR2G Datasheet - Page 20

• Manufacturer Part Number: NCV3066DR2G
• Description: IC LED DRIVER HIGH BRIGHT 8-SOIC
• Manufacturer: ON Semiconductor
• Type: HBLED Driverr

Specifications of NCV3066DR2G

• Constant Current: Yes
• Topology: PWM, Step-Down (Buck), Step-Up (Boost)
• Number Of Outputs: 1
• Internal Driver: Yes
• Type - Primary: Automotive
• Type - Secondary: High Brightness LED (HBLED)
• Frequency: 100kHz ~ 250kHz
• Voltage - Supply: 3 V ~ 40 V
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Operating Temperature: -40°C ~ 125°C
• Current - Output / Channel: 1.5A
• Internal Switch(s): Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Output: -
• Efficiency: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

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2X
8X
REFERENCE
2X
NOTE 4
PIN ONE
0.15
0.10
0.08
DETAIL A
0.15
K
C
C
C
e
C
BOTTOM VIEW
É É É É
É É
Ç Ç Ç
Ç Ç Ç Ç
Ç Ç Ç Ç Ç
SIDE VIEW
TOP VIEW
8
1
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
DETAIL B
D2
D
(A3)
Ç
Ç
4
5
A1
8X
B
A
E
E2
b
8X
A
0.10 C
0.05 C
L
C
SEATING
PLANE
EXPOSED Cu
NOTE 3
A B
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
USA/Canada
Phone: [phone]
Phone: 81−3−5773−3850
L1
Ç Ç Ç
Ç Ç Ç
É É É
http://onsemi.com
CASE 488AF−01
8 PIN DFN, 4x4
CONSTRUCTIONS
CONSTRUCTIONS
ISSUE C
DETAIL B
MOLD CMPD
ALTERNATE
DETAIL A
OPTIONAL
20
L
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
A1
É É É É
Ç Ç
4.30
L
A3
2.39
0.80
PITCH
SOLDERING FOOTPRINT*
NOTES:
1. DIMENSIONS AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
4. COPLANARITY APPLIES TO THE EXPOSED
5. DETAILS A AND B SHOW OPTIONAL
ASME Y14.5M, 1994.
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30MM FROM TERMINAL TIP.
PAD AS WELL AS THE TERMINALS.
CONSTRUCTIONS FOR TERMINALS.
DIM
A1
A3
D2
E2
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
L1
A
b
D
E
K
L
e
2.21
MILLIMETERS
0.80
0.00
0.25
1.91
2.09
0.20
0.30
MIN
−−−
4.00 BSC
4.00 BSC
0.80 BSC
0.20 REF
DIMENSIONS: MILLIMETERS
MAX
1.00
0.05
0.35
2.21
2.39
0.50
0.15
−−−
0.35
8X
0.63
8X
OUTLINE
PACKAGE
NCP3066/D