TZA3011AVH/C2,551 NXP Semiconductors, TZA3011AVH/C2,551 Datasheet
TZA3011AVH/C2,551
Specifications of TZA3011AVH/C2,551
TZA3011AVHW-S
TZA3011AVHW-S
Related parts for TZA3011AVH/C2,551
TZA3011AVH/C2,551 Summary of contents
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TZA3011A; TZA3011B 30 Mbit 3.2 Gbit/s A-rate Rev. 06 — 20 January 2005 1. General description The TZA3011 is a fully integrated laser driver for optical transmission systems with data rates up to 3.2 Gbit/s. The TZA3011 incorporates ...
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Philips Semiconductors 2.2 Control features Dual-loop control for constant and accurate optical average power level and extinction ratio (up to 2.7 Gbit/s) Optional average power loop control (up to 3.2 Gbit/s) Optional direct setting of modulation and bias currents 2.3 ...
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Philips Semiconductors 5. Block diagram AVR ER 32 (57) 31 (56 CCA 2 (3, 4) CURRENT V CCD CONVERSION I I one zero I MON 3 (5) DIN 20 100 k 4 (6) DINQ 20 5 ...
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Philips Semiconductors 6. Pinning information 6.1 Pinning Fig 2. Pin configuration TZA3011A and TZA3011B 9397 750 14437 Product data sheet TZA3011A; TZA3011B 30 Mbit 3.2 Gbit/s A-rate V 1 CCA V 2 CCD DIN 3 DINQ 4 TZA3011AVH ...
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Philips Semiconductors GNDESD ALRESET Fig 3. Bonding pad location TZA3011UH 6.2 Pin description Table 2: Symbol GND V CCA V CCD DIN DINQ TEST CIN CINQ GND ALRESET ENABLE ALOP ALMON 9397 750 14437 Product data sheet ...
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Philips Semiconductors Table 2: Symbol MAXOP VTEMP MAXMON RREF PWA GND LAQ LAQ LA LA GND BIAS V CCO MON BIASIN BIASOUT MODIN MODOUT ER AVR Table 3: Symbol GND V CCA V CCA V CCD V CCD DIN DINQ ...
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Philips Semiconductors Table 3: Symbol ENABLE GNDDFT ALOP ALMON i.c. MAXOP i.c. VTEMP MAXMON RREF GNDRF PWA GNDO LAQ LAQ LAQ LAQ GNDO i.c. GNDO GNDO LA i. GNDO BIAS V CCO V CCO ACDC 9397 750 ...
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Philips Semiconductors Table 3: Symbol GNDESD MON BIASIN BIASOUT GNDCCB MODIN GNDCCB i.c. MODOUT ER AVR [1] All GND connections should be used. All ground pads must be connected to ground. Recommended order of bonding: all GND first, then V ...
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Philips Semiconductors The circuit generates an internal common mode voltage for AC-coupled data and clock inputs and for single-ended applications > V DIN optical ‘one’ level of the laser. 7.2 Retiming The retiming function synchronizes the data with ...
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Philips Semiconductors The maximum allowable capacitive load on pins AVR, ER, BIASOUT and MODOUT is 100 pF. 7.6 Average loop control The average power control loop maintains a constant average power level of the monitor current over temperature and lifetime ...
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Philips Semiconductors 8. Limiting values Table 5: In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to ground; positive currents flow into the IC. Symbol V CCD V CCA V CCO V o(LA) V o(LAQ) ...
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Philips Semiconductors 9. Thermal characteristics Table 6: Thermal characteristics In compliance with JEDEC standards JESD51-5 and JESD51-7. Symbol Parameter R thermal resistance th(j-a) from junction to ambient 10. Static characteristics Table 7: Characteristics +85 C; ...
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Philips Semiconductors Table 7: Characteristics …continued + K/W; P amb th(j- AVR ...
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Philips Semiconductors Table 7: Characteristics …continued + K/W; P amb th(j- AVR ...
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Philips Semiconductors Table 7: Characteristics …continued + K/W; P amb th(j- AVR ...
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Philips Semiconductors 11. Dynamic characteristics Table 8: Characteristics + K/W; P amb th(j- AVR ...
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Philips Semiconductors 12. Application information 12.1 Design equations 12.1.1 Bias and modulation currents The bias and modulation currents are determined by the voltages on pins BIASIN and MODIN. These voltages are applied by pins BIASOUT and MODOUT for dual-loop control. ...
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Philips Semiconductors 12.1.2 Average monitor current and extinction ratio The average monitor current I by the source current (I current source external resistor ( MON The extinction ratio in dual-loop operation is determined by the ...
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Philips Semiconductors 12.1.3 Dual-loop control The dual-loop control measures the monitor current (I ‘one’ level and the I and I MON(zero) ratio setting according to MON ------------------------- - I The dual-loop controls the bias and ...
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Philips Semiconductors 12.1.5 Alarm monitor current The alarm threshold I I MAXMON which corresponds with sunk by an external current source or by connecting R I MON alarm 12.1.6 Pulse width adjustment The pulse width adjustment time ...
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Philips Semiconductors 12.2 TZA3011A with dual-loop control A simplified application using the TZA3011A with dual-loop control and with an AC-coupled laser at 3.3 V laser voltage is illustrated in and the extinction ratio are determined by the resistors R BIASOUT ...
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Philips Semiconductors 12.3 TZA3011B with dual-loop control A simplified application using the TZA3011B with dual-loop control and with a DC-coupled laser at 3 laser voltage is illustrated in the extinction ratio are determined by the resistors ...
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Philips Semiconductors 12.4 TZA3011B with average loop control A simplified application using the TZA3011B with average loop control and a DC-coupled laser at 3 laser voltage is illustrated in to ground for the average loop control. ...
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Philips Semiconductors 13. Package outline HBCC32: plastic thermal enhanced bottom chip carrier; 32 terminals; body 0.65 mm ball A1 index area DIMENSIONS (mm are the original dimensions ...
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Philips Semiconductors 14. Soldering 14.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages ...
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Philips Semiconductors – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, ...
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Philips Semiconductors [4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, ...
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Philips Semiconductors 15. Revision history Table 10: Revision history Document ID Release date TZA3011A_TZA3011B_6 20050120 Product data sheet • Modifications: The format of this data sheet has been redesigned to comply with the new presentation and information standard of Philips ...
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Philips Semiconductors 16. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualification III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...
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Philips Semiconductors 21. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...