TZA3047BVH/C1,557 NXP Semiconductors, TZA3047BVH/C1,557 Datasheet - Page 2

• Manufacturer Part Number: TZA3047BVH/C1,557
• Description: IC LASER DRIVER 1.25GBPS 32-HBCC
• Manufacturer: NXP Semiconductors
• Type: Laser Diode Driver (Fiber Optic)r

Specifications of TZA3047BVH/C1,557

• Data Rate: 1.25Gbps
• Number Of Channels: 1
• Voltage - Supply: 3.14 V ~ 3.47 V
• Current - Supply: 40mA
• Current - Modulation: 100mA
• Current - Bias: 100mA
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 32-HBCC
• Mounting Type: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 935270561557; TZA3047BVHW; TZA3047BVHW

Philips Semiconductors
CONTENTS
1.1
1.2
1.3
2
3
4
5
6
7
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10
7.11
8
9
10
2003 Jun 05
30 Mbits/s up to 1.25 Gbits/s laser drivers
FEATURES
General
Control features
Protection features
APPLICATIONS
GENERAL DESCRIPTION
ORDERING INFORMATION
BLOCK DIAGRAM
PINNING
FUNCTIONAL DESCRIPTION
Data and clock input
Retiming
Pulse width adjustment
Modulator output stage
Dual-loop control
Average loop control
Direct current setting
Soft start
Alarm functions
Enable
Reference block
LIMITING VALUES
THERMAL CHARACTERISTICS
DC CHARACTERISTICS
2
11
12
12.1
12.1.1
12.1.2
12.1.3
12.1.4
12.1.5
12.1.6
12.2
12.3
12.4
13
14
15
15.1
15.2
15.3
15.4
15.5
16
17
18
AC CHARACTERISTICS
APPLICATION INFORMATION
Design equations
Bias and modulation currents
Average monitor current and extinction ratio
Dual-loop control
Alarm operating current
Alarm monitor current
Pulse width adjustment
TZA3047A with dual-loop control
TZA3047B with dual-loop control
TZA3047B with average loop control
BONDING PAD LOCATIONS
PACKAGE OUTLINE
SOLDERING
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of surface mount IC packages for
wave and reflow soldering methods
DATA SHEET STATUS
DEFINITIONS
DISCLAIMERS
TZA3047A; TZA3047B
Product specification