STK14C88-3NF45I Cypress Semiconductor Corp, STK14C88-3NF45I Datasheet - Page 6

IC NVSRAM 256KBIT 45NS 32SOIC

STK14C88-3NF45I

Manufacturer Part Number
STK14C88-3NF45I
Description
IC NVSRAM 256KBIT 45NS 32SOIC
Manufacturer
Cypress Semiconductor Corp
Type
NVSRAMr
Datasheet

Specifications of STK14C88-3NF45I

Format - Memory
RAM
Memory Type
NVSRAM (Non-Volatile SRAM)
Memory Size
256K (32K x 8)
Speed
45ns
Interface
Parallel
Voltage - Supply
4.5 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Package / Case
32-SOIC (7.5mm Width)
Word Size
8b
Organization
32Kx8
Density
256Kb
Interface Type
Parallel
Access Time (max)
45ns
Operating Supply Voltage (typ)
3.3V
Package Type
SOIC
Operating Temperature Classification
Industrial
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Operating Temp Range
-40C to 85C
Pin Count
32
Mounting
Surface Mount
Supply Current
44mA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

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Document Number: 001-50592 Rev. *A
Software RECALL
Data is transferred from the nonvolatile memory to the SRAM
by a software address sequence. A software RECALL cycle is
initiated with a sequence of READ operations in a manner
similar to the software STORE initiation. To initiate the
RECALL cycle, the following sequence of CE controlled READ
operations is performed:
Internally, RECALL is a two step procedure. First, the SRAM
data is cleared, and then the nonvolatile information is trans-
ferred into the SRAM cells. After the t
SRAM is once again ready for READ and WRITE operations.
The RECALL operation does not alter the data in the nonvol-
atile elements. The nonvolatile data can be recalled an
unlimited number of times.
Preventing STORE
The STORE function can be disabled on the fly by holding HSB
high with a driver capable of sourcing 30 mA at a V
least 2.2V, because it has to overpower the internal pull down
device. This device drives HSB LOW for 20 μs at the onset of
a STORE. When the STK14C88-3 is connected for AutoStore
operation (system V
capacitor on V
down, the STK14C88-3 attempts to pull HSB LOW. If HSB
does not actually get below V
HSB LOW and aborts the STORE attempt.
Hardware Protect
The
inadvertent STORE operation and SRAM WRITEs during low
voltage conditions. When V
initiated STORE operations and SRAM WRITEs are inhibited.
Noise Considerations
The STK14C88-3 is a high speed memory. It must have a high
frequency bypass capacitor of approximately 0.1 µF
connected between V
are as short as possible. As with all high speed CMOS ICs,
careful routing of power, ground, and signals reduce circuit
noise.
1. Read address 0x0E38, Valid READ
2. Read address 0x31C7, Valid READ
3. Read address 0x03E0, Valid READ
4. Read address 0x3C1F, Valid READ
5. Read address 0x303F, Valid READ
6. Read address 0x0C63, Initiate RECALL cycle
STK14C88-3
CAP
) and V
CC
offers
CC
and V
connected to V
CC
hardware
IL
SS,
crosses V
CAP
, the part stops trying to pull
using leads and traces that
<V
SWITCH
RECALL
SWITCH
protection
CC
, all externally
cycle time, the
and a 68 μF
on the way
OH
against
of at
Low Average Active Power
CMOS technology provides the STK14C88-3 the benefit of
drawing significantly less current when it is cycled at times
longer than 50 ns.
between I
current consumption is shown for both CMOS and TTL input
levels (commercial temperature range, VCC = 3.6V, 100%
duty cycle on chip enable). Only standby current is drawn
when the chip is disabled. The overall average current drawn
by the STK14C88-3 depends on the following items:
Figure 4. Current Versus Cycle Time (READ)
Figure 5. Current Versus Cycle Time (WRITE)
1. The duty cycle of chip enable
2. The overall cycle rate for accesses
3. The ratio of READs to WRITEs
4. CMOS versus TTL input levels
5. The operating temperature
6. The V
7. I/O loading
CC
CC
level
and READ or WRITE cycle time. Worst case
Figure 4
and
Figure 5
show the relationship
STK14C88-3
Page 6 of 17
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