BCV62 /T3 NXP Semiconductors, BCV62 /T3 Datasheet
BCV62 /T3
Specifications of BCV62 /T3
Related parts for BCV62 /T3
BCV62 /T3 Summary of contents
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... BCV62 PNP general-purpose double transistors Rev. 4 — 26 July 2010 1. Product profile 1.1 General description PNP general-purpose double transistors in a small SOT143B Surface-Mounted Device (SMD) plastic package. Table 1. Type number BCV62 BCV62A BCV62B BCV62C 1.2 Features and benefits Low current (max. 100 mA) Low voltage (max ...
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... NXP Semiconductors Table 2. Symbol Transistor TR2 Pinning information Table 3. Pin Ordering information Table 4. Type number BCV62 BCV62A BCV62B BCV62C 4. Marking Table 5. Type number BCV62 BCV62A BCV62B BCV62C [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China BCV62 ...
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... NXP Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per transistor V CBO V CEO V EBS Per device P tot amb T stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB). 6. Thermal characteristics Table 7. Symbol ...
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... NXP Semiconductors Table 8. ° Symbol V BEsat Transistor TR2 V EBS h FE Transistors TR1 and TR2 [1] V BEsat [ [3] Device, without emitter resistors, mounted on an FR4 PCB. BCV62 Product data sheet Characteristics …continued C unless otherwise specified. ...
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... NXP Semiconductors 500 h FE 400 (1) 300 (2) 200 (3) 100 0 −2 −1 −10 −10 −1 = − 150 °C (1) T amb = 25 °C (2) T amb = −55 °C (3) T amb Fig 1. BCV62A: DC current gain as a function of collector current; typical values − CEsat (mV) −10 3 −10 ...
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... NXP Semiconductors 1000 h FE 800 600 (1) 400 (2) 200 (3) 0 −2 −1 −10 −10 −1 = − 150 °C (1) T amb = 25 °C (2) T amb = −55 °C (3) T amb Fig 5. BCV62B: DC current gain as a function of collector current; typical values − CEsat (mV) − ...
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... NXP Semiconductors 1000 h FE (1) 800 600 (2) 400 (3) 200 0 −2 −1 −10 −10 −1 = − 150 °C (1) T amb = 25 °C (2) T amb = −55 °C (3) T amb Fig 9. BCV62C: DC current gain as a function of collector current; typical values − CEsat (mV) −10 3 −10 ...
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... NXP Semiconductors −V CE1max (V) Fig 13. Maximum collector-emitter voltage as a function of emitter resistor 8. Test information Fig 14. Test circuit current matching Fig 15. Current mirror with emitter resistors BCV62 Product data sheet −30 −20 −10 0 − 1 (see Figure 15 −V CE1 ...
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... NXP Semiconductors 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. 9. Package outline Fig 16. Package outline SOT143B 10. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. ...
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... NXP Semiconductors 11. Soldering 0.7 (3×) 0.7 Fig 17. Reflow soldering footprint SOT143B 4.6 Fig 18. Wave soldering footprint SOT143B BCV62 Product data sheet 3.25 0.6 (3×) 0.5 (3×) 1.9 0.6 (3×) 0.6 0.75 0.95 0.9 1 4.45 2.2 2.575 1.2 All information provided in this document is subject to legal disclaimers. Rev. 4 — 26 July 2010 PNP general-purpose double transistors 2 3 Dimensions in mm 1.2 (3× ...
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... Document ID Release date BCV62 v.4 20100726 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Section 1 “Product • Section 3 “Ordering • ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 14. Contact information For more information, please visit: For sales office addresses, please send an email to: ...
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... NXP Semiconductors 15. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 8 8.1 Quality information . . . . . . . . . . . . . . . . . . . . . . 9 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 10 Packing information . . . . . . . . . . . . . . . . . . . . . 9 11 Soldering ...