IS42S16160B-7TL ISSI, Integrated Silicon Solution Inc, IS42S16160B-7TL Datasheet - Page 62

IC SDRAM 256MBIT 143MHZ 54TSOP

IS42S16160B-7TL

Manufacturer Part Number
IS42S16160B-7TL
Description
IC SDRAM 256MBIT 143MHZ 54TSOP
Manufacturer
ISSI, Integrated Silicon Solution Inc
Datasheet

Specifications of IS42S16160B-7TL

Package / Case
54-TSOP II
Memory Size
256M (16Mx16)
Format - Memory
RAM
Memory Type
SDRAM
Speed
143MHz
Interface
Parallel
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
0°C ~ 70°C
Data Bus Width
16 bit
Organization
32 Mbit x 8
Maximum Clock Frequency
143 MHz
Access Time
7 ns
Supply Voltage (max)
3.6 V
Supply Voltage (min)
3 V
Maximum Operating Current
130 mA
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
0 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
706-1018

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IS42S16160B-7TL
Manufacturer:
ISSI
Quantity:
596
Part Number:
IS42S16160B-7TL
Manufacturer:
ISSI
Quantity:
20 000
Part Number:
IS42S16160B-7TLI
Quantity:
4 320
Part Number:
IS42S16160B-7TLI-TR
Manufacturer:
ISSI
Quantity:
1 000
Company:
Part Number:
IS42S16160B-7TLI-TR
Quantity:
3 598
PACKAGING INFORMATION
Plastic TSOP 54–Pin, 86-Pin
Package Code: T (Type II)
Integrated Silicon Solution, Inc.
Rev. D
03/13/07
N
1
ZD
No. Leads (N)
Ref. Std.
Symbol
ZD
A1
A2
E1
L1
C
D
A
b
E
e
L
e
Plastic TSOP (T - Type II)
Min
22.02 22.42
10.03 10.29
11.56 11.96
Millimeters
0.71 REF
0.05
0.30
0.12
0.80 BSC
0.40
Max
1.20
0.15
0.45
0.21
0.60
54
D
Min
0.002 0.006
0.012 0.018
0.005 0.0083
0.867 0.8827
0.395 0.405
0.455 0.471
0.031 BSC
0.016 0.024
Inches
Max
0.047
N/2+1
b
N/2
E1
A
A1
No. Leads (N)
Ref. Std.
Symbol
E
A1
A2
E1
L1
ZD
A
C
D
E
b
e
L
SEATING PLANE
Plastic TSOP (T - Type II)
Min
Millimeters
22.02 22.42
10.03 10.29
11.56 11.96
0.05
0.95
0.17
0.12
0.40
0.80 REF
0.50 BSC
0.61 REF
Notes:
1. Controlling dimension: millimieters,
2. BSC = Basic lead spacing between
3. Dimensions D and E1 do not include
4. Formed leads shall be planar with
unless otherwise specified.
centers.
mold flash protrusions and
measured from the bottom of the
package
respect to one another within 0.004
inches at the seating plane.
L
Max
1.20
0.15
1.05
0.27
0.21
0.60
.
86
Min
0.002 0.006
0.037 0.041
0.007 0.011
0.005 0.008
0.867 0.8827
0.395 0.405
0.455 0.471
0.020 BSC
0.016 0.024
0.031 REF
Inches
0.024 BSC
Max
0.047
should be
C
1

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