IS62WV5128BLL-55HLI ISSI, Integrated Silicon Solution Inc, IS62WV5128BLL-55HLI Datasheet - Page 14

• Manufacturer Part Number: IS62WV5128BLL-55HLI
• Description: IC SRAM 4MBIT 55NS 32STSOP
• Manufacturer: ISSI, Integrated Silicon Solution Inc

Specifications of IS62WV5128BLL-55HLI

• Format - Memory: RAM
• Memory Type: SRAM - Asynchronous
• Memory Size: 4M (512K x 8)
• Speed: 55ns
• Interface: Parallel
• Voltage - Supply: 2.5 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 32-sTSOP
• Density: 4Mb
• Access Time (max): 55ns
• Sync/async: Asynchronous
• Architecture: Not Required
• Clock Freq (max): Not RequiredMHz
• Operating Supply Voltage (typ): 3.3V
• Address Bus: 19b
• Package Type: STSOP-I
• Operating Temp Range: -40C to 85C
• Number Of Ports: 1
• Supply Current: 45mA
• Operating Supply Voltage (min): 2.5V
• Operating Supply Voltage (max): 3.6V
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 32
• Word Size: 8b
• Number Of Words: 512K
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 706-1114; IS62WV5128BLL-55HLI

PACKAGING INFORMATION
Integrated Silicon Solution, Inc. — www.issi.com —
Rev. C
06/13/03
Plastic TSOP-Type I
Package Code: T (32-pin)
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
S
No. Leads
Symbol
A1
A
B
C
D
E
H
S
e
L
α
18.30
19.80
MILLIMETERS
Min.
0.05
0.17
0.12
7.90
0.40
—
0°
0.50 BSC
0.25 REF
e
D
18.50
20.20
Max.
1.20
0.25
0.23
0.17
8.10
0.60
8°
32
0.002
0.007
0.005
0.311
0.720
0.780
0.016
Min.
B
—
0°
0.020 BSC
0.010 REF
N
1
INCHES
A
E
0.047
0.010
0.009
0.007
0.319
0.728
0.795
0.024
Max.
A1
8°
1-800-379-4774
H
SEATING PLANE
Notes:
1. Controlling dimension: millimeters, unless
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold
4. Formed leads shall be planar with respect
L
otherwise specified.
flash protrusions and should be measured
from the bottom of the package.
to one another within 0.004 inches at the
seating plane.
α
C