TJA1022T,118 NXP Semiconductors, TJA1022T,118 Datasheet
TJA1022T,118
Specifications of TJA1022T,118
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TJA1022T,118 Summary of contents
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... Power consumption is very low when both transceivers are in Sleep mode. However, the TJA1022 can still be woken up via pins LIN1/LIN2 and SLP1_N/SLP2_N. 2. Features and benefits 2.1 General Two LIN transceivers in a single package LIN 2.0, LIN 2.1, LIN 2.2 and SAE J2602 compliant Baud rate kBd ...
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... NXP Semiconductors 2.2 Protection Very high ElectroMagnetic Immunity (EMI) Very high ESD robustness: 8 kV according to IEC 61000-4-2 for pins LIN1, LIN2 and V BAT Bus terminal and battery pin protected against transients in the automotive environment (ISO 7637) Bus terminal short-circuit proof to battery and ground ...
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... NXP Semiconductors 5. Block diagram TJA1022 1 RXD1 2 SLP1_N 3 DOM TXD1 TIMER 4 RXD2 5 SLP2_N 7 DOM TXD2 TIMER Fig 1. Block diagram TJA1022 Product data sheet POWER-ON RESET AND UNDERVOLTAGE DETECTION BUS TIMER TEMPERATURE CONTROL PROTECTION BUS TIMER All information provided in this document is subject to legal disclaimers. ...
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... NXP Semiconductors 6. Pinning information 6.1 Pinning RXD1 SLP1_N TXD1 RXD2 SLP2_N TXD2 a. TJA1022T: SO14 package Fig 2. Pin configuration diagrams 6.2 Pin description Table 3. Symbol RXD1 SLP1_N TXD1 RXD2 SLP2_N n.c. TXD2 GND LIN2 V BAT n.c. n.c. LIN1 n.c. [1] For enhanced thermal and electrical performance, the exposed center pad of the HVSON14 package should be soldered to board ground (and not to any other voltage level) ...
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... NXP Semiconductors 7. Functional description The TJA1022 is the interface between the LIN master/slave protocol controller and the physical bus in a LIN network. According to the Open System Interconnect (OSI) model, this is the LIN physical layer. The LIN transceivers are optimized for, but not limited to, automotive applications with excellent ElectroMagnetic Compatibility (EMC) performance ...
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... NXP Semiconductors Reset RXDx: floating Transmitter: off rising V > V BAT th(POR)H Sleep x RXDx: floating Transmitter: off (1) A positive edge on SLPx_N triggers a transition to Normal mode in the corresponding LIN transceiver; the LIN transmitter is enabled once TXDx goes HIGH; in the event of thermal shutdown, both LIN transceivers are disabled. ...
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... NXP Semiconductors If a remote wake-up event (see associated transceiver will switch to Standby mode. A wake-up initiated by the microcontroller (SLPx_N HIGH for t Normal mode while the other transceiver remains in its current state. 7.2.3 Standby mode Standby mode is an intermediate mode between Sleep and Normal modes. A transceiver will switch from Sleep mode to Standby mode in response to a LIN bus wake-up event ...
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... NXP Semiconductors 7.3 Transceiver wake-up 7.3.1 Remote wake-up via the LIN bus A falling edge on pin LINx followed by a LOW level maintained for t a rising edge on pin LINx triggers a remote wake-up (see the time period t Sleep mode irrespective of the status of pin TXDx. Fig 4. Remote wake-up behavior 7 ...
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... NXP Semiconductors If the voltage on pin V the TJA1022 switches to Reset mode (i.e. all output drivers are disabled and all inputs are ignored). The TJA1022 switches to Sleep mode if V 7.6 Fail-safe features Pin TXDx is pulled down to ground in order to force a predefined level on the transmit data input if the pin is disconnected. ...
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... NXP Semiconductors 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are referenced to pin GND, unless otherwise specified. Positive currents flow into the IC. Symbol Parameter V battery supply voltage BAT V voltage on pin TXD TXD V voltage on pin RXD ...
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... NXP Semiconductors 10. Static characteristics Table 7. Static characteristics +150 BAT vj flow into the IC; typical values are given at V Symbol Parameter Supply V battery supply voltage BAT I battery supply current BAT Undervoltage reset V LOW-level power-on reset th(POR)L ...
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... NXP Semiconductors Table 7. Static characteristics …continued +150 BAT vj flow into the IC; typical values are given at V Symbol Parameter I LOW-level input current IL Pin RXDx (open-drain) I LOW-level output current OL I HIGH-level leakage LH current Pin LINx I current limitation for driver ...
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... NXP Semiconductors 11. Dynamic characteristics Table 8. Dynamic characteristics +150 BAT vj flow into the IC; typical values are given at V Symbol Parameter Duty cycles 1 duty cycle 1 2 duty cycle 2 3 duty cycle 3 4 duty cycle 4 Timing characteristics ...
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... NXP Semiconductors t min 1 3 bus rec = ------------------------------- [2] . Variable t bus(rec)(min bit t max 2 4 bus rec ------------------------------- - [ Variable t bit [4] Bus load conditions and R BUS [5] See timing diagram in Figure 5 ...
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... NXP Semiconductors 12. Application information 12.1 Application diagram V DD RX0 TX0 RX1 MICRO- CONTROLLER TX1 Px.x Px.y GND (1) Master nF; slave 220 pF Fig 6. Application diagram 12.2 ESD robustness according to LIN EMC test specification ESD robustness (IEC 61000-4-2) has been tested by an external test house according to the LIN EMC test specification (part of Conformance Test Specification Package for LIN 2 ...
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... NXP Semiconductors 13. Test information 13.1 Quality information This product has been qualified to the appropriate Automotive Electronics Council (AEC) standard Q100 or Q101 and is suitable for use in automotive applications. TJA1022 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 1 — 30 March 2012 TJA1022 Dual LIN 2 ...
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... NXP Semiconductors 14. Package outline SO14: plastic small outline package; 14 leads; body width 3 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...
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... NXP Semiconductors HVSON14: plastic, thermal enhanced very thin small outline package; no leads; 14 terminals; body 3 x 4 terminal 1 index area terminal 1 index area Dimensions Unit max 1.00 0.05 0.35 4.6 mm nom 0.85 0.03 0.32 0.2 4.5 min 0.80 0.00 0.29 4.4 Outline version IEC SOT1086 Fig 8. Package outline SOT1086-2 (HVSON14) ...
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... NXP Semiconductors 15. Handling information All input and output pins are protected against ElectroStatic Discharge (ESD) under normal handling. When handling ensure that the appropriate precautions are taken as described in JESD625-A or equivalent standards. 16. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “ ...
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... NXP Semiconductors • Process issues, such as application of adhesive and flux, clinching of leads, board transport, the solder wave parameters, and the time during which components are exposed to the wave • Solder bath specifications, including temperature and impurities 16.4 Reflow soldering Key characteristics in reflow soldering are: • ...
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... NXP Semiconductors temperature MSL: Moisture Sensitivity Level Fig 9. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description”. 17. Soldering of HVSON packages Section 16 Surface Mounted Devices (SMD). A more detailed discussion on soldering HVSON leadless package ICs can be found in the following application notes: • ...
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... NXP Semiconductors 18. Mounting The TJA1022 pin layout has been designed to be compatible with the TJA1020, TJA1021 and TJA1027. This makes it possible to design a board with a single socket that can accommodate all four IC’s. The appropriate device would be inserted into the socket, depending on the application, as illustrated in WAKE_N Fig 10 ...
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... NXP Semiconductors 19. Revision history Table 12. Revision history Document ID Release date TJA1022 v.1 20120330 TJA1022 Product data sheet Data sheet status Change notice Product data sheet - All information provided in this document is subject to legal disclaimers. Rev. 1 — 30 March 2012 TJA1022 Dual LIN 2.2/SAE J2602 transceiver ...
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... Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations ...
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... NXP Semiconductors 22. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 2.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2.2 Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 3 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 7 Functional description . . . . . . . . . . . . . . . . . . . 5 7.1 LIN 2.x/SAE J2602 compliant . . . . . . . . . . . . . . 5 7.2 Operating modes . . . . . . . . . . . . . . . . . . . . . . . 5 7.2.1 Normal mode . . . . . . . . . . . . . . . . . . . . . . . . . . 5 7.2.2 Sleep mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 7.2.3 Standby mode ...