C8051F546-IMR Silicon Labs, C8051F546-IMR Datasheet - Page 24

• Manufacturer Part Number: C8051F546-IMR
• Description: 8-bit Microcontrollers - MCU 50 MIPS 8 kB 1kB LIN 2.1 SPI UART I2C
• Manufacturer: Silicon Labs

Specifications of C8051F546-IMR

• Rohs: yes
• Core: 8051
• Processor Series: C8051
• Data Bus Width: 8 bit

C8051F54x
24
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This Land Pattern Design is based on the IPC-7351 guidelines.
3. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the
4. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure
5. The stencil thickness should be 0.125 mm (5 mils).
6. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.
7. A No-Clean, Type-3 solder paste is recommended.
8. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body
Dimension
metal pad is to be 60 m minimum, all the way around the pad.
good solder paste release.
Components.
C1
C2
E
Table 4.2. QFP-32 Landing Diagram Dimensions
8.40
8.40
Min
Figure 4.2. QFP-32 Landing Diagram
0.80 BSC
Max
8.50
8.50
Rev. 1.1
Dimension
X1
Y1
0.40
1.25
Min
Max
0.50
1.35