MAX3344EEVKIT# Maxim Integrated, MAX3344EEVKIT# Datasheet - Page 11

• Manufacturer Part Number: MAX3344EEVKIT#
• Description: USB Interface IC 15kV ESD-Protected USB Transceivers in UCSP with USB Detect
• Manufacturer: Maxim Integrated

Specifications of MAX3344EEVKIT#

• Operating Supply Voltage: 3.3 V
• Operating Supply Current: 10 mA

The IEC 1000-4-2 standard covers ESD testing and per-
formance of finished equipment; it does not specifically
refer to integrated circuits. The MAX3344E/MAX3345E
help the user design equipment that meets level 4 of IEC
1000-4-2, without the need for additional ESD-protection
components.
The major difference between tests done using the
Human Body Model and IEC 1000-4-2 is a higher peak
current in IEC 1000-4-2, because series resistance is
lower in the IEC 1000-4-2 model. Hence, the ESD with-
stand voltage measured to IEC 1000-4-2 is generally
lower than that measured using the Human Body Model.
Figure 1c shows the IEC 1000-4-2 model.
The Air-Gap Discharge Method involves approaching
the device with a charged probe. The Contact
Discharge Method connects the probe to the device
before the probe is energized.
The Machine Model for ESD tests all pins using a 200pF
storage capacitor and zero discharge resistance. Its
objective is to emulate the stress caused by contact that
occurs with handling and assembly during manufactur-
ing. All pins require this protection during manufactur-
ing. Therefore, after PC board assembly, the Machine
Model is less relevant to I/O ports.
______________________________________________________________________________________
±15kV ESD-Protected USB Transceivers
Machine Model
IEC 1000-4-2
in UCSP with USB Detect
Two external 23.7Ω ±1% to 27.4Ω ±1%, 1/2W resistors
are required for USB connection. Place the resistors
in between the MAX3344E/MAX3345E and the USB
connector on the D+ and D- lines (see the Typical
Operating Circuit).
Use three external capacitors for proper operation. Use
a 0.1µF ceramic for decoupling V
decoupling V
filter capacitor on VTRM. Return all capacitors to GND.
For the latest application details on UCSP construction,
dimensions, tape carrier information, printed circuit board
techniques, bump-pad layout, and recommended reflow
temperature profile, as well as the latest information on
reliability testing results, refer to the Application Note
UCSP—A Wafer-Level Chip-Scale Package available on
Maxim’s website at www.maxim-ic.com/ucsp.
TRANSISTOR COUNT: 2162
PROCESS: BiCMOS
UCSP Applications Information
CC
Applications Information
, and a 1.0µF (min) ceramic or plastic
External Components
Chip Information
External Capacitors
L
, a 1µF ceramic for
External Resistors
11