RS-RL78G13-2200CC Redpine Signals, RS-RL78G13-2200CC Datasheet - Page 12

no-image

RS-RL78G13-2200CC

Manufacturer Part Number
RS-RL78G13-2200CC
Description
WiFi / 802.11 Modules Wi-Fi Companion Card for Renesas
Manufacturer
Redpine Signals
Datasheet

Specifications of RS-RL78G13-2200CC

Rohs
yes
Protocol Supported
802.11 b/g/n
Frequency Band
2.4 GHz
Interface Type
SPI, UART
Antenna Connector Type
Chip
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Security
WEP 64/128 bit AES, WPA, WPA2-PSK
2.5 Recommended Reflow Profile
2.6 Baking Instructions
Redpine Signals, Inc.
R
R
NOTE: The profile shown is based on SAC 305 solder (3% silver, 0.5%
copper). We recommend the ALPHA OM-338 lead-free solder paste. This
profile is provided mainly for guidance. The total dwell time depends on the
thermal mass of the assembled board and the sensitivity of the components
on it.
The RS9110-N-11-22 package is moisture sensitive and devices must be
handled appropriately. After the devices are removed from their vacuum
sealed packs, they should be taken through reflow for board assembly within
168 hours at room conditions, or stored at under 10% relative humidity. If
these conditions are not met, the devices must be baked before reflow. The
recommended baking time is nine hours at 125 C.
S
S
-
-
9
9
1
1
1
1
0
0
M
M
-
-
N
N
o
o
-
-
d
d
1
1
u
u
1
1
l
l
-
e
-
e
2
2
w
w
2
2
i
i
V
V
S
S
t
t
D
D
h
e
h
e
e
e
a
a
r
r
l
l
N
N
t
t
f
s
f
s
Figure 5:Reflow Profile
a
a
i
i
e
C
C
e
o
o
s
s
t
t
o
o
h
n
h
n
w
w
n
n
e
e
2
2
o
t
o
t
e
e
a
a
.
.
r
r
t
t
0
0
k
i
i
k
n
n
i
i
n
e
e
n
d
g
d
g
8
S
8
S
0
t
0
t
a
a
2
2
c
c
.
.
k
k
1
1
1
1
b
b
/
/
g
g
/
/
n
n
12

Related parts for RS-RL78G13-2200CC