MAX9322ECY+D Maxim Integrated, MAX9322ECY+D Datasheet - Page 6

• Manufacturer Part Number: MAX9322ECY+D
• Description: Communication ICs - Various
• Manufacturer: Maxim Integrated
• Type: Differential Divide-by-1/Divide-by-2 Clock Driverr

Specifications of MAX9322ECY+D

• Package / Case: TQFP-52
• Supply Voltage - Max: +/- 3.8 V
• Supply Voltage - Min: +/- 2.375 V
• Supply Current: 66 mA
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Operating Supply Voltage: +/- 2.5 V, +/- 3.3 V
• Supply Type: Analog

The MAX3785 6.25Gbps PC board equalizer consists
of an equalizer, limiting amplifier, offset driver, and off-
set cancellation circuit (see Figure 2). The equalizer
block compensates for the attenuation caused by the
PC board. The limiting amplifier squares up the signal
at the output of the equalizer block. The offset cancella-
tion circuit corrects for internal offset in the limiting
amplifier to minimize pulse-width distortion. This intro-
duces a low-frequency cutoff. The data must achieve a
50% mark/space ratio in less than 100µs. The specified
minimum differential input must be maintained to avoid
oscillation.
An equivalent DC input circuit is shown in Figure 3. It
has an equivalent DC differential input resistance of
100Ω. The output buffer is implemented using current-
mode logic (CML), as shown in Figure 4.
The chip-scale package (UCSP) has a bump pitch of
0.5mm (19.7 mils) and a bump diameter of 0.3mm (12
6.25Gbps, 1.8V PC Board Equalizer
6
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PIN
PIN
A1
A2
A3
C1
C2
C3
—
1
2
3
4
5
6
Input and Output Structures
NAME
NAME
OUT+
OUT+
OUT-
OUT-
GND
GND
V
V
IN+
IN+
IN-
IN-
EP
Functional Description
CC
CC
Package Description
Negative Data Input (CML)
Supply Ground
Negative Data Output (CML)
Positive Data Output (CML)
Supply Voltage
Positive Data Input (CML)
Exposed Pad
Negative Data Input, CML
Supply Ground
Negative Data Output, CML
Positive Data Input, CML
Supply Voltage
Positive Data Output, CML
FUNCTION (MAX3785UBL)
FUNCTION (MAX3785UTT)
mils). Lay out the solder pad spacing on 0.5mm (19.7
mils), a pad size of 0.25mm (10 mils) and a solder
mask opening of 0.33mm (13 mils). Round or square
pads are permissible. For detailed information on UCSP
layout and handling, go to Maxim’s website,
www.maxim-ic.com. The enclosed package descrip-
tion was accurate at the time of publication. For the
MAX3785, all the balls shown in row B of the drawing
are unpopulated. See the Package Information section
for the latest package information.
Figure 2. Functional Diagram of the MAX3785
IN+
IN-
MAX3785UBL Pin Description
MAX3785UTT Pin Description
MAX3785
EQUALIZER
LIMITER
ADJUST
OFFSET
OUTPUT
BUFFER
OUT+
OUT-