WT11i-A-AI3 Bluegiga Technologies, WT11i-A-AI3 Datasheet - Page 18

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WT11i-A-AI3

Manufacturer Part Number
WT11i-A-AI3
Description
Bluetooth / 802.15.1 Modules WT11i Class1 2.1+EDR Chip Ant, iWRAP 3.0
Manufacturer
Bluegiga Technologies
Datasheet

Specifications of WT11i-A-AI3

Rohs
yes
Class
1
Frequency Band
2.4 GHz
Sensitivity
- 83 dBm
Operating Supply Voltage
3.3 V
Output Power
17 dBm
Interface Type
GPIO, UART, USB
Antenna Connector Type
Chip
Maximum Operating Temperature
+ 85 C
Dimensions
35.8 mm x 14.5 mm x 2.3 mm
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
WT11I-A-AI3
Manufacturer:
SILICON
Quantity:
1 000
– Keep the trace as short as possible
A good practice is to dedicate one of the inner layers to a solid GND plane and one of the inner layers to
supply voltage planes and traces and route all the signals on top and bottom layers of the PCB. This
arrangement will make sure that any return current follows the forward current as close as possible and any
loops are minimized.
AGND) so that the path for the return current is cut. If this is not possibl
not separate GND regions but keep one solid GND plane.
Recommended PCB layer configuration
Figure 15: Use of stitching vias to avoid emissions from the edges of the PCB
Overlapping GND layers without
GND stitching vias
Figure 14: Typical 4-layer PCB construction
Bluegiga Technologies Oy
Overlapping GND layers with
GND stitching vias shielding the
RF energy
Signals
GND
Power
Signals
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