SPBT2532C2.AT2 STMicroelectronics, SPBT2532C2.AT2 Datasheet - Page 17

• Manufacturer Part Number: SPBT2532C2.AT2
• Description: Bluetooth / 802.15.1 Modules Bluetooth V2.1 Mod Class2 SPP AT Rev2
• Manufacturer: STMicroelectronics

Specifications of SPBT2532C2.AT2

• Rohs: yes
• Class: 2
• Frequency Band: 2.4 GHz
• Sensitivity: - 85 dBm
• Data Rate: 2 Mbps
• Operating Supply Voltage: - 0.3 V to + 5 V
• Interface Type: UART
• Maximum Operating Temperature: + 55 C
• Dimensions: 10.5 mm x 13.5 mm

SPBT2532C2.AT2
7
Note:
7.1
1
2
3
4
Hardware design
The SPBT2532C2.AT2 module with AT2 command embedded FW supports UAR and GPIO
hardware interfaces. Note that the usage of these interfaces is dependent upon the firmware
that is loaded into the module, and is beyond the scope of this document. The AT2
command interface uses the main UART by default.
All unused pins should be left floating; do not ground.
All GND pins must be well grounded.
The area around the module should be free of any ground planes, power planes, trace
routings, or metal, for 6 mm from the antenna in all directions.
Traces should not be routed underneath the module.
Module reflow installation
The SPB2532C2.AT2 is a surface mount Bluetooth module supplied on a 14-pin, 6-layer
PCB. The final assembly recommended reflow profiles are indicated here below.
The soldering phase must be executed with care: in order to avoid undesired melting
phenomenon, particular attention must be paid to the setup of the peak temperature.
The following are some suggestions for the temperature profile based on IPC/JEDEC J-
STD-020C, July 2004 recommendations.
Table 8.
Average ramp-up rate (T
Preheat:
– Temperature min. (T
– Temperature max. (T
– Time (t
Time maintained above:
– Temperature T
– Temperature T
Peak temperature (T
Time within 5 °C of actual peak temperature (T
Ramp-down rate
Time from 25 °C to peak temperature
s
min. to t
Soldering
L
L
s
max.)(t
P
)
S
S
Profile feature
min.)
SMAX
max.)
s
)
to T
Doc ID 023461 Rev 1
P
)
P
)
PB-free assembly
8 minutes max.
3 °C/sec max.
60-100 sec
240 + 0 °C
60-70 sec
10-20 sec
6 °C/sec
150 °C
200 °C
217 °C
Hardware design
17/27