K4T51043QI SAMSUNG [Samsung semiconductor], K4T51043QI Datasheet
K4T51043QI
Related parts for K4T51043QI
K4T51043QI Summary of contents
Page 1
... DDR2 SDRAM Memory Product Guide SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, without warranties of any kind. This document and all information discussed herein remain the sole and exclusive property of Samsung Electronics ...
Page 2
... Product Guide 1. DDR2 SDRAM MEMORY ORDERING INFORMATION SAMSUNG Memory DRAM DRAM Type Density Bit Organization 1. SAMSUNG Memory : K 2. DRAM : 4 3. DRAM Type T : DDR2 SDRAM 4. Density 56 : 256Mb 51 : 512Mb 1G : 1Gb 2G : 2Gb 4G : 4Gb 5. Bit Organization ...
Page 3
... Product Guide 2. DDR2 SDRAM Component Product Guide 2.1 SDRAM Density Banks Part Number K4T51043QI K4T51083QI 512Mb I-die 4Banks K4T51163QI K4T1G044QQ K4T1G084QQ 1Gb Q-die 8Banks K4T1G164QQ K4T1G044QE K4T1G084QE 1Gb E-die 8Banks K4T1G164QE K4T1G044QF K4T1G084QF 1Gb F-die 8Banks K4T1G164QF K4T2G044QA 2Gb A-die 8Banks K4T2G084QA DDR2 SDRAM Memory Package & ...
Page 4
... Product Guide 3. DDR2 SDRAM Module Ordering Information Memory Module DIMM Type Data bits DRAM Component Type Depth # of Banks in Comp. & Interface Bit Organization 1. Memory Module : M 2. DIMM Type 3 : DIMM 4 : SODIMM 3. Data Bits ...
Page 5
... Product Guide 4. DDR2 SDRAM Module Product Guide Org. Density Part Number M378T6464QZ(H)3 64Mx 64 512MB M378T6464EHS M378T2863QZ(H)S 128Mx 64 M378T2863EHS M378T2863FBS 1GB M391T2863QZ(H)3 128Mx 72 M391T2863EH3 M391T2863FB3 M378T5663QZ(H)3 256Mx 64 M378T5663EH3 M378T5663FB3 2GB M391T5663QZ(H)3 256Mx 72 M391T5663EH3 M391T5663FB3 512Mx 64 M378T5263AZ(H)3 4GB 512Mx 72 M391T5263AZ(H)3 240Pin DDR2 Unbuffered DIMM Comp ...
Page 6
... Apr. 2010 DDR2 SDRAM Memory Internal Rank PKG Height Banks Q-die ball E-die 30mm FBGA I-die 4 2 Q-die 84 ball ...
Page 7
... CD5/CC 1Gb 256M 36pcs 1Gb CF7/E6 512M 18pcs 2Gb CE6/D5 DDP 512M 36pcs 1Gb CF7/E6 st. 18pcs 2Gb - 7 - DDR2 SDRAM Memory Internal Rank PKG Height Banks Q-die ball 30mm FBGA F-die Q-die ...
Page 8
... CF7/E6 1Gb Q-die 128M 18pcs 1Gb F-die CF7/E6 DDP 512M 18pcs 1Gb Q-die CE6/D5 QDP 18pcs 1Gb Q-die - 8 - DDR2 SDRAM Memory Internal Rank PKG Height Banks 60 ball 4 1 18.3mm FBGA 60 ball 8 1 18.3mm FBGA F-die ...
Page 9
... IDT IDT C1 256M 18pcs 2Gb 8: IDT L4 8: IDT L4 DDP 512M 36pcs 1Gb 6 : IDT C1 st. 18pcs 2Gb 8: IDT Apr. 2010 DDR2 SDRAM Memory Internal Rank PKG Height Banks 60 ball G-die 4 1 30.35mm FBGA Q-die 60 ball ...
Page 10
... IDT L4 128M 18pcs 1Gb 8: IDT L4 256M 36pcs 1Gb 8: IDT L4 128M 36pcs 8: IDT L4 256M 18pcs 2Gb 8: IDT L4 st. 18pcs 2Gb - 10 - Apr. 2010 DDR2 SDRAM Memory Internal Rank PKG Height Banks 60 ball Q-die 8 1 30.35mm FBGA 60 ball Q-die 8 2 30.35mm ...
Page 11
... FBGA for 1Gb Q-die (x16) 9.00 ± 0.10 0. 0.80 1. (0.95) (1.90) Bottom # A1 INDEX MARK A B #A1 Top # A1 INDEX MARK A B #A1 Top - 11 - DDR2 SDRAM Memory 9.00 ± 0.10 9.00 ± 0.10 Apr. 2010 0.35±0.05 1.10±0.10 0.35±0.05 1.10±0.10 ...
Page 12
... (Datum (0.95) MOLDING AREA (1.90) 84-∅0.45 Solder ball (Post reflow 0.50 ± 0.05) 0 Bottom INDEX MARK 7.50 ± 0.10 #A1 B Top INDEX MARK 7.50 ± 0.10 B #A1 Top - 12 - Apr. 2010 DDR2 SDRAM Memory 0.35±0.05 1.10±0.10 0.35±0.05 1.10±0.10 ...
Page 13
... (0.30) 84-∅0.48 Solder ball (0.60) (Post reflow 0.50 ± 0.05) 0 Bottom INDEX MARK B # MOLDING AREA INDEX MARK B # MOLDING AREA - 13 - Apr. 2010 DDR2 SDRAM Memory 7.50 ± 0.10 0.37±0.05 Top 7.50 ± 0.10 0.37±0.05 1.10±0.10 Top 1.10±0.10 ...
Page 14
... (Datum (0.95) (1.90) 68-∅0.45 Solder ball (Post reflow 0.50 ± 0.05) 0 Bottom # INDEX MARK 1 MOLDING AREA - 14 - Apr. 2010 DDR2 SDRAM Memory 11.00 ± 0.10 0.35 ± 0.05 1.10 ± 0.10 Top 0.10MAX ...