MTSM0350-WR-A MARKTECH [Marktech Corporate], MTSM0350-WR-A Datasheet - Page 5

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MTSM0350-WR-A

Manufacturer Part Number
MTSM0350-WR-A
Description
3.2 x 2.8mm SMD TYPE
Manufacturer
MARKTECH [Marktech Corporate]
Datasheet
PRECAUTION IN USE
Storage
Soldering
*After reflow soldering rapid cooling should be avoided.
[Temperature-profile (Surface of circuit board)]
Use the conditions shown to the under figure.
[ Recommended soldering pad design ]
Use the following conditions shown in the figure.
Pre-heat
Pre-heat time
Peak temperature
Soldering time
Condition
Recommended storage environment
Temperature: 5
Humidity:
Use within 7 days after opening of sealed vapor/ESD barrier bags.
If the mois ture absorbent mater ial (s ilica ge l) has faded a way or the LEDs have exceeded the
storage time, baking treatment should be performed using the following conditions.
Baking treatment : 60±5℃ for 24 hours.
Fold the opened bag firmly and keep in dry environment.
2.2
2.5~5°C/sec.
T
Pre-heating
120sec. Max.
120~150°C
<1 : Lead Solder>
2.5~5°C/sec.
60% RH Max.
Reflow So ldering
o
120~150℃ 180~200
120sec. Max.
240℃ Max.
10sec. Max.
profile 1
refer to
C ~ 30
emperature-
Lead Solder
MT0350-WR-A
(UNIT:mm)
o
C (41
60sec. Max.
o
F ~ 86
240°C Max.
10sec. Max.
o
F)
120sec. Max.
260℃ Max .
10sec. Max.
refer to
Temperature-
profile 2
Lead – free Solder
VER.: 01 Date : 2009/10/ 09 Page: 4/
1~5°C/sec.
<2 : Lead-free Solder>
Pre-heating
180~200°C
120sec. Max.
Temperature
Soldering time
1~5°C/sec.
3.2 x 2.8mm SMD TYPE
Hand Soldering
60sec. Max.
350℃ Max .
3sec. Max.
(one time only)
260°C Max.
10sec. Max.

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