HEF4007UBP,652 NXP Semiconductors, HEF4007UBP,652 Datasheet - Page 10

• Manufacturer Part Number: HEF4007UBP,652
• Description: IC DUAL PAIR/INVERTER 14-DIP
• Manufacturer: NXP Semiconductors
• Series: 4000Br

Specifications of HEF4007UBP,652

• Package / Case: 14-DIP (0.300", 7.62mm)
• Logic Type: Configurable Multiple Function
• Number Of Circuits: 2
• Number Of Inputs: 1
• Mounting Type: Through Hole
• Logic Family: HEF4000
• Number Of Channels Per Chip: 3
• Polarity: Inverting
• Supply Voltage (max): 15 V
• Supply Voltage (min): 3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• High Level Output Current: - 3.6 mA (Min)
• Input Bias Current (max): 4 uA
• Low Level Output Current: 3.6 mA (Min)
• Minimum Operating Temperature: - 40 C
• Propagation Delay Time: 80 ns @ 5 V or 40 ns @ 10 V or 30 ns @ 15 V
• Number Of Lines (input / Output): 3 / 3
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Supply: -
• Operating Temperature: -
• Output Type: -
• Current - Output High, Low: -
• Schmitt Trigger Input: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-4849-5; 933324210652; HEF4007UBP,652; HEF4007UBPN; HEF4007UBPN

Philips Semiconductors
January 1995
SSOP16: plastic shrink small outline package; 16 leads; body width 5.3 mm
Package information
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT338-1
max.
2.0
A
0.21
0.05
A
1
16
Z
1
y
1.80
1.65
A
2
IEC
e
pin 1 index
0.25
A
3
D
0.38
0.25
b
p
MO-150AC
0.20
0.09
JEDEC
c
b
p
8
9
REFERENCES
D
6.4
6.0
0
(1)
w
M
E
5.4
5.2
(1)
c
scale
EIAJ
2.5
0.65
10
e
H
7.9
7.6
A
E
2
A
5 mm
1.25
1
L
1.03
0.63
L
E
H
p
E
detail X
0.9
0.7
Q
L
L
p
PROJECTION
Q
EUROPEAN
0.2
v
(A )
Package outlines
3
A
0.13
w
A
0.1
X
y
v
ISSUE DATE
M
94-01-14
95-02-04
A
1.00
0.55
Z
(1)
SOT338-1
8
0
o
o