AM29F200B AMD [Advanced Micro Devices], AM29F200B Datasheet
AM29F200B
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AM29F200B Summary of contents
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... Am29F200B Known Good Die Data Sheet Continuity of Specifications Continuity of Ordering Part Numbers For More Information Qˆiyvph‡v‚ÃIˆ€ir… à ! !$& à Sr‰v†v‚ à 6€rq€r‡ à à D††ˆrÃ9h‡r à ...
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... SUPPLEMENT Am29F200B Known Good Die 2 Megabit (256 K x 8-Bit/128 K x 16-Bit) CMOS 5.0 Volt-only, Sectored Flash Memory—Die Revision 1 DISTINCTIVE CHARACTERISTICS ■ 5.0 V ± 10% for read and write operations — Minimizes system level power requirements ■ Manufactured on 0.32 µm process technology — Compatible with 0.5 µm Am29F200A device ■ ...
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... GENERAL DESCRIPTION The Am29F200B in Known Good Die (KGD) form Mbit, 5.0 Volt-only Flash memory. AMD defines KGD as standard product in die form, tested for functionality and speed. AMD KGD products have the same reli- ability and quality as AMD products in packaged form. Am29F200B Features The Am29F200B is organized as 262,144 bytes of 8 bits each or 131,072 words of 16 bits each ...
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... DIE PHOTOGRAPH DIE PAD LOCATIONS 1314 1920 AMD logo location Am29F200B Known Good Die 2627 ...
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... Am29F200B Known Good Die Pad Center (millimeters 0.0000 0.0000 –0.1727 0.0000 –0.3251 0.0000 –0.4724 0.0000 –0.6223 0.0000 –0.7696 0.0000 –0.9220 0.0000 –1.0693 0.0000 –1.2192 0.0000 –1.4148 0.0356 –1.4605 – ...
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... AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is formed by a combination of the following: Am29F200B T -75 DP DEVICE NUMBER/DESCRIPTION Am29F200B Known Good Die 2 Megabit (256 K x 8-Bit/128 K x 16-Bit 5.0 Volt-only Program and Erase Valid Combinations AM29F200BT-75, AM29F200BB-75 (70 ns 5.0 V ± ...
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... Surftape Packaging Direction of Feed Gel-Pak and Waffle Pack Packaging Orientation relative to top left corner of Gel-Pak and Waffle Pack cavity plate AMD logo location Am29F200B Known Good Die Orientation relative to leading edge of tape and reel AMD logo location ...
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... PRODUCT TEST FLOW Figure 1 provides an overview of AMD’s Known Good Die test flow. For more detailed information, refer to the Am29F200B product qualification database supple- ment for KGD. AMD implements quality assurance pro- cedures throughout the product test flow. In addition, 24 hours at 250°C ...
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... AMD recommends assembly in a Class 10K clean room with 30% to 60% relative humidity. Storage (max) = 130°C J Store at a maximum temperature of 30° nitrogen- purged cabinet or vacuum-sealed bag. Observe all standard ESD handling procedures. Am29F200B Known Good Die (Bottom Boot .98480ABK ...
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... SHALL HAVE BEEN DETERMINED TO BE DEFEC- TIVE OR NON CONFORMING. Buyer agrees that it will make no warranty representa- tions to its customers which exceed those given by AMD to Buyer unless and until Buyer shall agree to indemnify AMD in writing for any claims which exceed AMD's warranty. Am29F200B Known Good Die 9 ...
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... T +145°C. Revision D+3 (November 17, 1999) Global Replaced references to high temperature ratings with a note to contact AMD for such devices. Revision D+4 (June 27, 2001) Manufacturing Information Added Penang, Malaysia as a test facility (ACN2016). Am29F200B Known Good Die (max) for this range is J ...