M36L0R7050 ST Microelectronics, M36L0R7050 Datasheet - Page 16
M36L0R7050
Manufacturer Part Number
M36L0R7050
Description
128 Mbit (Multiple Bank / Multi-Level / Burst) Flash Memory 32 Mbit (2M x16) PSRAM
Manufacturer
ST Microelectronics
Datasheet
1.M36L0R7050.pdf
(18 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
M36L0R7050B0ZAQ
Manufacturer:
ST
Quantity:
20 000
Part Number:
M36L0R7050B4ZAQ
Manufacturer:
ST
Quantity:
20 000
Part Number:
M36L0R7050T0ZAQ
Manufacturer:
ST
Quantity:
20 000
Company:
Part Number:
M36L0R7050T1ZAQF
Manufacturer:
ST
Quantity:
9 495
Company:
Part Number:
M36L0R7050T2ZAQF
Manufacturer:
ST
Quantity:
5 575
Company:
Part Number:
M36L0R7050T4
Manufacturer:
ST
Quantity:
9 505
Company:
Part Number:
M36L0R7050T4ZAQ
Manufacturer:
Numonyx
Quantity:
310
M36L0R7050T0, M36L0R7050B0
PART NUMBERING
Table 11. Ordering Information Scheme
Example:
M36 L 0 R 7 0 5 0 T 0 ZAQ T
Device Type
M36 = Multi-Chip Package (Multiple Flash + RAM)
Flash 1 Architecture
L = Multilevel, Multiple Bank, Burst mode
Flash 2 Architecture
0 = No Die
Operating Voltage
R = V
= V
= V
= 1.7 to 1.95V
DDF1
DDP
DDQ
Flash 1 Density
7 = 128 Mbit
Flash 2 Density
0 = No Die
RAM 1 Density
5 = 32 Mbit
RAM 0 Density
0 = No Die
Parameter Blocks Location
T = Top Boot Block Flash
B = Bottom Boot Block Flash
Product Version
0 = 0.13µm Flash technology, 85ns speeds;
0.18µm RAM, 85ns speed
Package
ZAQ = Stacked TFBGA88 8x10mm - 8x10 active ball array, 0.8mm pitch
Option
Blank = Standard Packing
T = Tape & Reel Packing
E= Lead-free and RoHS package, standard packing
F= Lead-free and RoHS package, tape and reel packing
Devices are shipped from the factory with the memory content bits erased to ’1’. For a list of available op-
tions (Speed, Package, etc.) or for further information on any aspect of this device, please contact the ST-
Microelectronics Sales Office nearest to you.
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