HIP0082 Intersil Corporation, HIP0082 Datasheet - Page 9

• Manufacturer Part Number: HIP0082
• Description: Quad Power Drivers with Serial Diagnostic Interface
• Manufacturer: Intersil Corporation

A3
Power Small Outline Plastic Package (PSOP)
REF.
0.15
D1
SLUG
HEAT
3.10 REF.
N
-B-
DETAIL "A"
c
E
E3
E1
SECTION "B-B"
b
b
1
E2
2 PLACES
A1
SEE DETAIL "A"
A2
1.60 REF.
c
3
2
1
1
L
HIP0082, HIP0084
0.10
-A-
B
B
D
C
SEATING
PLANE
-H-
A
SEATING
PLANE
L1
-C-
9
GAUGE
PLANE
0-8
e
o
b
M20.433
20 LEAD POWER SMALL OUTLINE PLASTIC
PACKAGE
NOTES:
SYMBOL
1. Dimensioning and tolerancing per ANSI Y14.5M-1982.
2. "C" is a reference datum. Seating plane is defined by
3. Dimension D does not include mold flash, protrusions
4. Dimension E1 does not include interlead flash or pro-
5. Dimension "L" is the length of terminal for soldering to
6. The lead width dimension does not include dambar
7. Section "B-B" to be determined at 0.10mm to 0.25mm
8. Controlling dimension: MILLIMETER.
9. Dimensions conform with JEDEC Outline MO-166AA
A1
A2
A3
D1
D2
E1
E2
E3
b1
L1
lead tips only.
or gate burrs. Mold flash, protrusions or gate burrs
shall not exceed 0.15 per side. D measured at -H-.
trusion. Interlead flash or protrusion shall not exceed
0.15 per side. E1 measured at -H-.
a substrate.
protrusion. Allowable dambar protrusion shall be
0.08mm total in excess of the lead width dimension at
maximum material condition.
from the lead tip.
Issue B.
c1
A
D
E
N
2.87
b
c
e
L
1
N
0.122
0.004
0.118
0.000
0.016
0.016
0.009
0.009
0.622
0.496
0.547
0.429
0.228
0.031
MIN
0.050 BSC
0.014 BSC
-
-
INCHES
e
20
0.142
0.012
0.130
0.004
0.021
0.020
0.013
0.011
0.630
0.512
0.043
0.571
0.437
0.114
0.244
0.043
17.15
13.92
MAX
LAND PATTERN
15.80
12.60
13.90
10.90
0.71
MILLIMETERS
3.10
0.10
3.00
0.00
0.40
0.40
0.23
0.23
5.80
0.80
MIN
-
-
1.27 BSC
0.35 BSC
20
16.00
13.00
14.50
11.10
3.60
0.30
3.30
0.10
0.53
0.50
0.32
0.29
1.10
2.90
6.20
1.10
MAX
2.21
Rev. 0 3/96
1.52
4.22
NOTES
6, 7
6, 7
4.09
7.26
4.09
7
7
3
4
5
-
-
-
-
-
-
-
-
-
-
-
-