24LC16B-MT MicrochipTechnology, 24LC16B-MT Datasheet

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24LC16B-MT

Manufacturer Part Number
24LC16B-MT
Description
8K/16KI2CSerialEEPROMsinISOMicromodules
Manufacturer
MicrochipTechnology
Datasheet
I
FEATURES
• ISO 7816 compliant contact locations
• Single supply with operation from 2.5-5.5V
• Low power CMOS technology
• Organized as 4 or 8 blocks of 256 bytes
• 2-wire serial interface bus, I
• Schmitt trigger inputs for noise suppression
• Output slope control to eliminate ground bounce
• 100 kHz (2.5V) and 400kHz (5V) compatibility
• Self-timed write cycle (including auto-erase)
• Page-write buffer for up to 16 bytes
• 2 ms typical write cycle time for page-write
• ESD protection > 4,000V
• 1,000,000 ERASE/WRITE cycles guaranteed
• Data retention > 200 years
• Temperature range
DESCRIPTION
The Microchip Technology Inc. 24LC08B/16B are 8K
and 16K bit Electrically Erasable PROMs in ISO mod-
ules for smart card applications. The device is orga-
nized as four or eight blocks of 256 x 8-bit memory with
a 2-wire serial interface. The 24LC08B and 24LC16B
also have a page-write capability for up to 16 bytes of
data.
M
2
C is a trademark of Philips Corporation.
- 1 mA active current typical
- 10 A standby current typical at 5.5V
(4 x 256 x 8) or (8 x 256 x 8)
- Commercial (C):
1997 Microchip Technology Inc.
8K/16K I
2
C
0˚C to
2
C
24LC08B/16B MODULES
Serial EEPROMs in ISO Micromodules
compatible
+70˚C
ISO MODULE LAYOUT
BLOCK DIAGRAM
SDA
CONTROL
V
V
LOGIC
CC
SS
I/O
SCL
SCL
V
DD
CONTROL
MEMORY
LOGIC
XDEC
V
SDA
SS
DS21224A-page 1
HV GENERATOR
PAGE LATCHES
R/W CONTROL
SENSE AMP
EEPROM
ARRAY
YDEC

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24LC16B-MT Summary of contents

Page 1

... The Microchip Technology Inc. 24LC08B/16B are 8K and 16K bit Electrically Erasable PROMs in ISO mod- ules for smart card applications. The device is orga- nized as four or eight blocks of 256 x 8-bit memory with a 2-wire serial interface. The 24LC08B and 24LC16B also have a page-write capability for bytes of data trademark of Philips Corporation ...

Page 2

MODULES 1.0 ELECTRICAL CHARACTERISTICS 1.1 Maximum Ratings* V ...................................................................................7.0V CC All inputs and outputs w.r.t. V ................-0. Storage temperature ..................................... -65˚C to +150˚C Ambient temp. with power applied................. -65˚C to +125˚C Soldering temperature of leads (10 ...

Page 3

TABLE 1-3 AC CHARACTERISTICS All parameters apply across the specified operat- ing ranges unless otherwise noted. Parameter Symbol Clock frequency F CLK Clock high time T HIGH Clock low time T LOW SDA and SCL rise time T R SDA ...

Page 4

MODULES 2.0 PAD DESCRIPTIONS 2.1 SDA (Serial Data) This is a Bi-directional pin used to transfer addresses and data into and data out of the device open drain terminal, therefore the SDA bus requires a pull-up ...

Page 5

... B1, B0). They are used by the master device to select which of the eight 256 word blocks of memory are to be accessed. These bits are in effect the three most significant bits of the word address. The last bit of the control byte defines the operation to be performed ...

Page 6

... But instead of generating a stop condition the master transmits data bytes to the 24LC08B/16B which are temporarily stored in the on-chip page buffer and will be written into the memory after the master has transmitted a stop condition. After the receipt of each word, the four lower order address pointer bits are internally incremented by one ...

Page 7

... To provide sequential reads the 24LC08B/16B contains an internal address pointer which is incremented by one at the completion of each operation. This address pointer allows the entire memory contents to be serially read during one operation. 8.4 Noise Protection The 24LC08B/16B employs a V ...

Page 8

MODULES FIGURE 8-1: CURRENT ADDRESS READ S T BUS ACTIVITY A MASTER SDA LINE BUS ACTIVITY FIGURE 8-2: RANDOM READ S T BUS ACTIVITY A CONTROL MASTER BYTE SDA LINE BUS ACTIVITY FIGURE ...

Page 9

SHIPPING METHOD The micromodules will be shipped to customers in clear plastic trays. Each tray holds 150 modules, and the trays can be stacked in a manner similar to shipping die in waffle packs. A tray drawing with dimensions ...

Page 10

MODULES FIGURE 9-2: MODULE DIMENSIONS DS21224A-page 10 1997 Microchip Technology Inc. ...

Page 11

... Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. 1997 Microchip Technology Inc. 24LC08B/16B MODULES MT = Micromodules in trays Blank = 0˚C to +70˚C 2 24LC08B 8K bit 2. Serial EEPROM in ISO Module 2 24LC16B 16K bit 2. Serial EEPROM in ISO Module DS21224A-page 11 ...

Page 12

M W ORLDWIDE AMERICAS Corporate Office Microchip Technology Inc. 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 602-786-7200 Fax: 602-786-7277 Technical Support: 602 786-7627 Web: http://www.microchip.com Atlanta Microchip Technology Inc. 500 Sugar Mill Road, Suite 200B Atlanta, GA 30350 Tel: ...

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