ISD25120 Winbond, ISD25120 Datasheet
ISD25120
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ISD25120 Summary of contents
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ISD2560/75/90/120 SINGLE-CHIP, MULTIPLE-MESSAGES, VOICE RECORD/PLAYBACK DEVICE 60-, 75-, 90-, AND 120-SECOND DURATION Publication Release Date: May 2003 - 1 - Revision 1.0 ...
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... Recordings are stored into on-chip nonvolatile memory cells, providing zero-power message storage. This unique, single-chip solution is made possible through Winbond’s patented multilevel storage technology. Voice and audio signals are stored directly into memory in their natural form, providing high-quality, solid-state voice reproduction ...
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BLOCK DIAGRAM Internal Clock XCLK ANA IN Amp ANA OUT MIC Pre- Amp MIC REF Automatic AGC Gain Control (AGC) Power Conditioning CCA SSA SSD Timing Sampling Clock 5-Pole Active Analog Transceivers Antialiasing Filter 480K ...
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TABLE OF CONTENTS 1. GENERAL DESCRIPTION.................................................................................................................. 2 2. FEATURES ......................................................................................................................................... 2 3. BLOCK DIAGRAM .............................................................................................................................. 3 4. TABLE OF CONTENTS ...................................................................................................................... 4 5. PIN CONFIGURATION ....................................................................................................................... 5 6. PIN DESCRIPTION ............................................................................................................................. 6 7. FUNCTIONAL DESCRIPTION.......................................................................................................... 10 7.1. Detailed Description.................................................................................................................... ...
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PIN CONFIGURATION A0/M0 1 A1/M1 2 A2/M2 3 A3/M3 4 A4/M4 5 A5/M5 6 A6/M6 7 ISD2560 AUX SSD V 13 SSA SOIC/PDIP * Same pinouts ...
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PIN DESCRIPTION PIN NO. PIN NAME SOIC/ TSOP PDIP Ax/Mx 1-10/ 8-17/ 1-7 8-14 AUX 13, 12 20, 19 SSA SSD SP+/SP- 14/15 21/22 [1] Connection of speaker outputs in parallel may cause ...
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... The capacitor value, together with the internal 10 KΩ resistance on this pin, determines the low-frequency cutoff for the ISD2500 series passband. See Winbond’s Application Information for additional information on low-frequency cutoff calculation. Microphone Reference : The MIC REF input is the inverting input to the microphone preamplifier ...
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PIN NO. PIN NAME SOIC/ TSOP PDIP 22 1 OVF EOM FUNCTION Overflow : This signal pulses LOW at the end of memory array, indicating the device has been filled and the ...
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... ISD2575 6.4 kHz ISD2590 5.3 kHz ISD25120 4.0 kHz These recommended clock rates should not be varied because the antialiasing and smoothing filters are fixed, and aliasing problems can occur if the sample rate differs from the one recommended. The duty cycle on the input clock is not critical, as the clock is immediately divided by two ...
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... Part Number (Seconds) ISD2560 ISD2575 ISD2590 ISD25120 * 3db roll-off point EEPROM Storage One of the benefits of Winbond’s ChipCorder providing zero-power message storage. The message is retained for up to 100 years typically without power. In addition, the device can be re-recorded typically over 100,000 times. ...
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Programming The ISD2500 series is also ideal for playback-only applications, where single or multiple messages are referenced through buttons, switches microcontroller. Once the desired message configuration is created, duplicates can easily be generated via a gang programmer. 7.2. ...
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Operational Modes Description The Operational Modes can be used in conjunction with a microcontroller, or they can be hardwired to provide the desired system operation. M0 – Message Cueing Message Cueing allows the user to skip through messages, without ...
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M6 – Push-Button Mode The ISD2500 series contain a Push-Button Operational Mode. The Push-Button Mode is used primarily in very low-cost applications and is designed to minimize external circuitry and components, thereby reducing system cost. In order to configure the ...
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The P/ R pin is taken LOW. 3. The CE pin is pulsed LOW. Recording starts, EOM goes HIGH to indicate an operation in progress. 4. When the CE pin is pulsed LOW. Recording pauses, EOM goes back LOW. ...
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... Good Audio Design Practices Winbond products are very high-quality single-chip voice recording and playback systems. To ensure the highest quality voice reproduction important that good audio design practices on layout and power supply decoupling be followed. See Application Information or below links for details. ...
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TIMING DIAGRAMS CE T SET P/R Don't Care PD Don't Care A0-A9 T SET MIC ANA IN T PUD OVF CE T SET P/R Don't Care PD Don't Care A0-A9 T SET SP+/- OVF EOM T CE Don't Care ...
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Start (Start/Pause) T SET P/R T SET PD (Stop/Reset) T SET A0-A9 MIC ANA IN OVF T RUN EOM (Run) T PUD Notes (1) (2) (3) FIGURE 3: PUSH-BUTTON MODE RECORD Start (Start/Pause) T ...
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Notes for Push-Button modes: 1. A9, A8, and for push-button operation. 2. The first CE LOW pulse performs a start function. 3. The part will begin to play or record after a power-up delay T 4. The ...
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ABSOLUTE MAXIMUM RATINGS TABLE 4: ABSOLUTE MAXIMUM RATINGS (DIE) Junction temperature Storage temperature range Voltage applied to any pad Voltage applied to any pad (Input current limited to ± 20mA) V – TABLE 5: ABSOLUTE MAXIMUM ...
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O C PERATING ONDITIONS TABLE 6: OPERATING CONDITIONS (DIE) CONDITION Commercial operating temperature range [1] Supply voltage ( [2] Ground voltage ( TABLE 7: OPERATING CONDITIONS (PACKAGED PARTS) CONDITION Commercial operating temperature range [1] Supply ...
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... ANA IN to SP+/- Gain A AGC Output Resistance R Notes: [1] Typical values @ T = 25º and [2] All Min/Max limits are guaranteed by Winbond via electrical testing or characterization. Not all specifications are 100 percent tested. [3] V and V connected together. CCA CCD [4] XCLK pin only. P ACKAGED ...
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... ISD2560 ISD2575 ISD2590 ISD25120 Playback Duration ISD2560 ISD2575 ISD2590 ISD25120 CE Pulse Width Control/Address Setup Time Control/Address Hold Time Power-Up Delay ISD2560 ISD2575 ISD2590 ISD25120 PD Pulse Width (record) ISD2560 ISD2575 ISD2590 ISD25120 TABLE 9: AC PARAMETERS – Packaged Parts [2] [1] SYMBOL MIN TYP F S 8.0 6.4 5 ...
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... ISD2560 ISD2575 ISD2590 ISD25120 PD Pulse Width (Static) Power Down Hold EOM Pulse Width ISD2560 ISD2575 ISD2590 ISD25120 Overflow Pulse Width Total Harmonic Distortion Speaker Output Power Voltage Across Speaker Pins MIC Input Voltage ANA IN Input Voltage AUX Input Voltage Notes: [1] Typical values @ T = 25º ...
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Typical Parameter Variation with Voltage and Temperature (Packaged Parts) Chart 1: Record Mode Operating Current ( - Temperature (C) 5.5 Volts 4.5 Volts Chart 2: Total Harmonic Distortion 0.7 0.6 ...
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... AUX IN/SP+ Gain ANA IN to SP+/- Gain AGC Output Resistance Notes: [1] Typical values @ T = 25°C and V A [2] All Min/Max limits are guaranteed by Winbond via electrical testing or characterization. Not all specifications are 100 percent tested. [3] V and V connected together. CCA CCD [4] XCLK pad only. ...
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... Record Duration ISD2560 ISD2575 ISD2590 ISD25120 Playback Duration ISD2560 ISD2575 ISD2590 ISD25120 CE Pulse Width Control/Address Setup Time Control/Address Hold Time Power-Up Delay ISD2560 ISD2575 ISD2590 ISD25120 PD Pulse Width (Record) ISD2560 ISD2575 ISD2590 ISD25120 TABLE 11: AC PARAMETERS – Die [2] [1] SYMBOL MIN TYP F S 8.0 6.4 5.3 4 ...
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... ISD2560 ISD2575 ISD2590 ISD25120 PD Pulse Width (Static) Power Down Hold EOM Pulse Width ISD2560 ISD2575 ISD2590 ISD25120 Overflow Pulse Width Total Harmonic Distortion Speaker Output Power Voltage Across Speaker Pins MIC Input Voltage ANA IN Input Voltage AUX Input Voltage Notes: [1] Typical values @ T = 25° ...
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Typical Parameter Variation with Voltage and Temperature (Die) Chart 5: Record Mode Operating Current ( -40 25 Temperature (C) 6.5 Volts 5.5 Volts Chart 6: Total Harmonic Distortion 0.7 0.6 0.5 ...
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... ISD2590 ISD25120 PD Pulse Width (Stop/Restart EOM HIGH CE to EOM LOW CE HIGH Debounce ISD2560 ISD2575 ISD2590 ISD25120 Notes: [1] Typical values @ T = 25°C and V A [2] All Min/Max limits are guaranteed by Winbond via electrical testing or characterization. Not all specifications are 100 percent tested. ...
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TYPICAL APPLICATION CIRCUIT Ω CHIP ENABLE 100 K POWER DOWN PLAYBACK/RECORD Note: If desired, pin 18 (PDIP package) may be left unconnected (microphone preamplifier noise will be higher). In this case, pin 18 must not ...
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TABLE 13: APPLICATION EXAMPLE – BASIC DEVICE CONTROL Control Step 1 Power up chip and select Record/Playback Mode 2 Set message address for record/playback 3A Begin playback 3B Begin record 4A End playback 4B End record TABLE 14: APPLICATION EXAMPLE ...
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... Because the microcontroller is interpreting the buttons and commanding the ISD2500 device, software can be written for any function desired in a particular application. Note: Winbond does not recommend connecting address lines directly to a microprocessor bus. Address lines should be externally latched. V ...
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100 K Ω S1 START / PAUSE S1 STOP / RESET PLAYBACK / RECORD FIGURE 7: ISD2560/75/90/120 APPLICATION EXAMPLE – PUSH-BUTTON Note: Please refer to page 13 for more details. ISD2560/75/90/120 ...
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TABLE 15: APPLICATION EXAMPLE – PUSH-BUTTON CONTROL Control Step Function 1 Select Record/Playback Mode 2A Begin playback 2B Begin record 3 Pause record or playback 4A End playback 4B End record TABLE 16: APPLICATION EXAMPLE – PASSIVE COMPONENT FUNCTIONS Part ...
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PACKAGE DRAWING AND DIMENSIONS 12.1. 28-L 300-M P EAD ...
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P EAD IL LASTIC INCHES Min Nom A 1.445 1.450 B1 0.150 B2 0.065 0.070 C1 0.600 C2 0.530 0.540 D D1 0.015 E 0.125 F 0.015 0.018 G 0.055 0.060 H 0.100 J 0.008 0.010 S ...
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EAD Plastic Thin ...
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... Y: 262 mils [2] Die Thickness o 11 mils Pad Opening o 111 x 111 microns 4.4 x 4.4 mils Notes: [1] The backside of die is internally connected to V occur. [2] Die thickness is subject to change, please contact Winbond factory for status and availability RODUCT ONDING HYSICAL ISD2560/75/90/120X ≈ A7 ...
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ISD2560/75/90/120 PRODUCT PAD DESIGNATIONS (with respect to die center) Pad Pad Name A0 Address 0 A1 Address 1 A2 Address 2 A3 Address 3 A4 Address 4 A5 Address 5 A6 Address 6 A7 Address 7 A8 Address 8 A9 ...
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... P = 28-Lead 600mil Plastic Dual Inline Package (PDIP 28-Lead 300mil Small Outline Integrated Circuit (SOIC 28-Lead 8x13.4 mm Thin Small Outline Package (TSOP) Type Die Part Number Part Number ISD2575P ISD2590P ISD2575S ISD2590S ISD2575E ISD2590E ISD2575X ISD2590X - 40 - ISD2560/75/90/120 Part Number ISD25120P ISD25120S ISD25120X ...
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VERSION HISTORY VERSION DATE PAGE 0 Apr. 1998 All 1.0 May 2003 All DESCRIPTION Preliminary Specifications Re-format the document. Update TSOP pin configuration. Revise Overflow pad designation ISD2560/75/90/120 Publication Release Date: May 2003 Revision 1.0 ...
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... The contents of this document are provided only as a guide for the applications of Winbond products. Winbond makes no representation or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to discontinue or make changes to specifications and product descriptions at any time without notice. No license, whether express or implied, to any intellectual property or other right of Winbond or others is granted by this publication ...