TMP47C222FG TOSHIBA [Toshiba Semiconductor], TMP47C222FG Datasheet - Page 3

• Manufacturer Part Number: TMP47C222FG
• Description: TLCS-47 Series.
• Manufacturer: TOSHIBA [Toshiba Semiconductor]

Previous Part Number
1. Part number
2. Package code and dimensions
3. Addition of notes on lead solderability
Lead solderability of Pb-free devices (with the G suffix)
(in Body Text)
*
TMP47C222N
TMP47C422N
TMP47C222U
TMP47C422U
TMP47C222F
TMP47C422F
: For the dimensions of the new package, see the attached Package Dimensions diagram.
Solderability
The following solderability test is conducted on the new device.
Test
(1) Use of Lead (Pb)
(2) Use of Lead (Pb)-Free
Previous Package Code
·use of R-type flux
·solder bath temperature = 245°C
·dipping time = 5 seconds
·the number of times = once
·use of R-type flux
·solder bath temperature = 230°C
·dipping time = 5 seconds
·the number of times = once
P-QFP44-1414-0.80D
P-QFP44-1414-0.80D
P-QFP44-1010-0.80
P-QFP44-1010-0.80
P-SDIP42-600-1.78
P-SDIP42-600-1.78
(in Body Text)
Test Conditions
New Part Number
II
TMP47C222NG
TMP47C422NG
TMP47C222UG
TMP47C422UG
TMP47C222FG
TMP47C422FG
Leads with over 95% solder coverage
New Package Code
LQFP44-P-1010-0.80A
LQFP44-P-1010-0.80A
QFP44-P-1414-0.80K
QFP44-P-1414-0.80K
till lead forming are acceptable.
SDIP42-P-600-1.78
SDIP42-P-600-1.78
Remark
TMP47C222/422
TMP47P422VNG
TMP47P422VNG
TMP47P422VUG
TMP47P422VUG
TMP47P422VFG
TMP47P422VFG
2008-03-06
OTP