VNI4140K-32 STMICROELECTRONICS [STMicroelectronics], VNI4140K-32 Datasheet
VNI4140K-32
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VNI4140K-32 Summary of contents
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... V out Description The VNI4140K- monolithic device made using STMicroelectronics VIPower technology, intended for driving four independent resistive, capacitive or inductive loads with one side connected to ground. Active current limitation avoids the system power supply dropping in the case of shorted load. Built-in thermal shutdown protects the chip from overtemperature and short- circuit ...
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... Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 5 Truth table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 6 Thermal management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 7 Switching waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 8 Pin functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 9 Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 9.1 VNI4140K-32 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 10 Reverse polarity protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 11 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 12 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 2/26 Doc ID022576 Rev 3 VNI4140K-32 ...
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... VNI4140K-32 1 Pin connection Figure 2. Pin connection (top view) Table 1. Pin description Pin Name Tab TAB 1 Vcc 2 IN1 3 STAT1 4 IN2 5 STA2 6 GND 7 STAT3 8 IN3 9 STAT4 10 IN4 OUT4 14 OUT4 15 OUT4 16 OUT3 17 OUT3 V CC IN1 STAT1 IN2 STAT2 GND STAT3 IN3 STAT4 ...
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... Channel 2 power stage output, internally protected Channel 2 power stage output, internally protected Channel 2 power stage output, internally protected Channel 1 power stage output, internally protected Channel 1 power stage output, internally protected Channel 1 power stage output, internally protected Doc ID022576 Rev 3 VNI4140K-32 Description ...
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... VNI4140K-32 2 Maximum ratings Table 2. Absolute maximum rating Symbol V Power supply voltage CC -V Reverse supply voltage ground reverse current GND I Output current (continuos) OUT I Reverse output current (per channel Input current (per channel Input voltage IN V Status pin voltage ...
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... OUT OUT GND = 125 °C J (1) Channel in ON state < 125 ° input rise time < 0.1 µ Test condition Doc ID022576 Rev 3 VNI4140K-32 Min. Typ. Max. Unit 10 0.080 0.140 250 µA 2 µ ...
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... VNI4140K-32 Figure 3. Switching parameter conventions Doc ID022576 Rev 3 Electrical characteristics 7/26 ...
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... Test conditions Test conditions I = 1.6 mA STAT < LOAD Dynamic load = STAT > OUT LOAD Doc ID022576 Rev 3 VNI4140K-32 Min. Typ. Max. Unit 0.8 V 2. 210 Min. Typ. Max. Unit 0 10.5 V 0.4 0.5 V 1.01 2 ...
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... VNI4140K-32 Figure 4. Current and voltage conventions Doc ID022576 Rev 3 Electrical characteristics 9/26 ...
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... Truth table 5 Truth table Table 9. Truth table (Current limitation before thermal shutdown) 10/26 Conditions Normal operation Overtemperature Undervoltage Shorted load Doc ID022576 Rev 3 VNI4140K-32 INPUTn OUTPUTn STATUSn ...
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... VNI4140K-32 6 Thermal management The power dissipation in the IC is the main factor that sets the safe operating condition of the device in the application. Therefore, it must be very carefully considered. Furthermore, the available space on the PCB should be chosen considering the power dissipation. Heatsinking can be achieved using copper on the PCB with proper area and thickness. Two different protections have been implemented to guarantee safety of the device if it overheats due to an overloaded condition or high environment temperature ...
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... Switching waveforms 7 Switching waveforms Figure 6. Switching waveforms 12/26 Doc ID022576 Rev 3 VNI4140K-32 ...
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... VNI4140K-32 8 Pin functions Figure 7. Input circuit Figure 8. Status circuit Doc ID022576 Rev 3 Pin functions 13/26 ...
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... Pin functions Figure 9. Charge pump switching frequency (typical) vs. temperature 2000 1800 1600 1400 1200 1000 800 -50 14/26 Freq_CP 0 50 100 temperature("C) Doc ID022576 Rev 3 VNI4140K-32 Freq_CP 150 200 ...
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... VNI4140K-32 9 Package and PCB thermal data 9.1 VNI4140K-32 thermal data Figure 10. VNI4140K-32 PCB Note: Layout condition of R FR4 area = mm, PCB thickness=1.6 mm, Cu thickness = 70 mm (front and back side), Copper areas: from minimum pad layout Figure 11. R thJA and Z measurements (PCB: Double layer, Thermal Vias, ...
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... Package and PCB thermal data Figure 12. VNI4140K-32 thermal impedance junction ambient single pulse (one channel ON) 16/26 Doc ID022576 Rev 3 VNI4140K-32 ...
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... VNI4140K-32 10 Reverse polarity protection This schematic can be used with any type of load. The following is an indication on how to dimension the (- (-I GND CC where -I is the DC reverse ground pin current and can be found in the absolute GND maximum rating section of the device datasheet. ...
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... Package mechanical data 11 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at:www.st.com. ® ECOPACK trademark. 18/26 Doc ID022576 Rev 3 VNI4140K-32 ® ...
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... VNI4140K-32 Table 10. PowerSSO-24 mechanical data Symbol Figure 14. PowerSSO-24 package dimensions mm Min. Typ. 2.15 2.15 0 0.33 0.23 10.10 7.4 0.8 8.8 10.1 0.55 4.1 6.5 Doc ID022576 Rev 3 Package mechanical data Max. 2.47 2.40 0.075 0.51 0.32 10.50 7.6 0.1 0.06 10.5 0.4 0.85 10deg 4.7 7.1 19/26 ...
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... Package mechanical data Figure 15. PowerSSO-24 tube shipment (no suffix) Table 11. PowerSSO-24 tube shipment Base Q.ty Bulk Q.ty Tube length (± 0. (± 0.1) Note: All dimensions are in mm. 20/26 1225 532 3.5 13.8 0.6 Doc ID022576 Rev 3 VNI4140K-32 49 ...
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... VNI4140K-32 Figure 16. PowerSSO-24 reel shipment (suffix “TR”) Table 12. PowerSSO-24 reel dimensions Base Q.ty Bulk Q.ty A (max.) B (min.) C (± 0. ± (min.) T (max.) 1000 1000 330 20.2 24.4 100 30.4 Doc ID022576 Rev 3 Package mechanical data 1.5 13 21/26 ...
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... Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing Note: According to the electronic industries association (EIA) standard 481 rev. A, Feb 1986. 22/ (± 0. (± 0.05) D1 (min) F (± 0.1) K (max) P1 (± 0.1) Doc ID022576 Rev 3 VNI4140K- 1.55 1.5 11.5 2.85 2 ...
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... VNI4140K-32 Figure 18. VNI4140K-32 suggested footprint Note: STMicroelectronics is not responsible for any PCB related issues. The footprint shown in the above figure is a suggestion which might not be in line to the customer PCB supplier design rules. All dimensions are in mm. Doc ID022576 Rev 3 Package mechanical data ...
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... Ordering information 12 Ordering information Table 14. Ordering information Order codes VNI4140K-32 VNI4140KTR-32 24/26 Package PowerSSO-24 PowerSSO-24 Doc ID022576 Rev 3 VNI4140K-32 Packaging Tube Tape and reel ...
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... VNI4140K-32 13 Revision history Table 15. Document revision history Date 12-Dec-2011 06-Feb-2012 07-Mar-2012 Revision 1 Initial release. Updated I minimum value in lim diagnostic. 2 Inserted new feature: ESD according to IEC 61000-4 +/-25 KV, in cover page. Suggested footprint inserted Table 5. parameter I Doc ID022576 Rev 3 Revision history ...
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... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 26/26 Please Read Carefully: © 2012 STMicroelectronics - All rights reserved STMicroelectronics group of companies www.st.com Doc ID022576 Rev 3 VNI4140K-32 ...