ADP222ACPZ-1218-R7 AD [Analog Devices], ADP222ACPZ-1218-R7 Datasheet - Page 22

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ADP222ACPZ-1218-R7

Manufacturer Part Number
ADP222ACPZ-1218-R7
Description
Dual, 300 mA Output, Low Noise
Manufacturer
AD [Analog Devices]
Datasheet
ADP222/ADP223/ADP224/ADP225
PRINTED CIRCUIT BOARD LAYOUT
CONSIDERATIONS
Heat dissipation from the package can be improved by
increasing the amount of copper attached to the pins of the
ADP222/ADP223/ADP224/ADP225. However, as listed in
Table 6, a point of diminishing returns is eventually reached
beyond which an increase in the copper size does not yield
significant heat dissipation benefits.
Place the input capacitor as close as possible to the VIN and
GND pins. Place the output capacitor as close as possible to the
VOUTx and GND pins. Use of 0402 or 0603 size capacitors and
resistors achieves the smallest possible footprint solution on
boards where area is limited.
Rev. B | Page 22 of 24
ADP223 - ________ - EVALZ
TB2
TB3
Figure 76. Example 8-Lead LFCSP PCB Layout
DEVICES
ANALOG
J2
J1
TB1
U1
R4
GND
R1 R2
C3
TB7
R3
C2
C1
GND
TB5
TB4
TB6
Data Sheet

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