FAN1539_05 FAIRCHILD [Fairchild Semiconductor], FAN1539_05 Datasheet - Page 3

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FAN1539_05

Manufacturer Part Number
FAN1539_05
Description
1A/1.3A, LDO with Low Quiescent Current
Manufacturer
FAIRCHILD [Fairchild Semiconductor]
Datasheet
FAN1539/FAN1540 Rev. 1.1.1
Absolute Maximum Ratings
Notes:
3. Junction to ambient thermal resistance,
4. Soldering temperature should be 260
5. Using Mil Std. 883E, method 3015.7(Human Body Model) and EIA/JESD22C101-A (Charge Device Model).
Operating Input Voltage
Power Dissipation
Short Circuit Output Current
Operating Junction Temperature Range
Thermal Resistance–Junction to Tab, TO-252
Thermal Resistance–Junction to Tab, 3mmx3mm 6-lead MLP (Note 3)
Thermal Resistance–Junction to Tab, 5mmx6mm 8-lead MLP (Note 3)
Storage Temperature Range (Note 3)
Lead Temperature (I.R. Reflow) 30 Sec. (Note 4)
Lead Temperature (Soldering) 10 Sec. (Note 4)
Electrostatic Discharge Protection (Note 5)
number of copper plains, number of via used, diameter of via used, available copper surface, and attached heat sink
characteristics.Thermal resistance (
Maximum rate of temperature rise is 3
Parameter
θ
JA
°
°
C for 10 second after 240
), V
C/SEC to within 100
θ
JA,
IN
, I
is a strong function of PCB material, board thickness, thickness and
OUT
must be chosen not to exceed T
3
°
C of the final temperature.
°
CDM
HBM
C for 30 second in I.R. reflow using 60/40 solder.
Symbol
T
T
T
I
ESD
V
OSH
θ
θ
θ
LEAD
LEAD
P
T
STG
JC
JC
JC
IN
D
J
J
= 150
-65 to 150
Internally
Internally
0 to 150
Limited
Limited
°
Value
C.
240
260
10
3
8
4
4
2
www.fairchildsemi.com
Units
° C/W
° C/W
° C/W
° C
° C
° C
° C
kV
W
V
A

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